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Journal of Materials Engineering and Performance

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01-08-2012

Suppression of Interdiffusion in Copper/Tin Thin Films

Authors: Harald Etschmaier, Holger Torwesten, Hannes Eder, Peter Hadley

Published in: Journal of Materials Engineering and Performance | Issue 8/2012

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Abstract

Copper/tin thin film couples are often used in microelectronics assembly as device backside coatings for die attach and also as circuit board coatings to maintain solderability. In this article, we report a temperature treatment that slows down the room temperature reaction of these two metals and therefore can extend the storage life of the devices significantly. It was found by x-ray diffraction that during an anneal at 473 K for 1 minute a thin layer of the Cu/Sn ε-phase is formed which introduces an additional interface to the system. The diffusion suppressing effect of this treatment was studied by focused ion beam microscopy.

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E. Bradley and K. Banerji, Effect of PCB Finish on the Reliability and Wettability of Ball Grid Array Packages, IEEE Trans. Compon. Packag. Manuf. Technol. B, 2002, 19, p 320–330CrossRef

K. Guth, D. Siepe, J. Görlich, H. Torwesten, R. Roth, F. Hille, et al., New Assembly and Interconnects Beyond Sintering Methods, PCIM 2010 Conference Proceedings, 2010

Directive 2002/95/EC of the European Parliament and of the Council, 2003

R. Vogel, Aging Characteristics of Immersion Tin Surface Finishes: An Investigation of This Surface Finish’s Aging and Its Reliability During Soldering, Circuits Assembly, December 1, 2003

Y.-J. Oh and S.-Y. Oh, Inhomogeneous Consumption of the Electroless Ni-P Layer at the Solder Joint Formed With Sn-3.5Ag-0.7Cu, J. Electron. Mater, 2009, 38, p 2554–2562CrossRef

K.N. Tu and R.D. Thompson, Kinetics of Interfacial Reaction in Bimetallic Cu–Sn thin films, Acta Metall., 1982, 30, p 947–952CrossRef

B.F. Dyson, Interstitial Diffusion of Copper in Tin, J. Appl. Phys., 1967, 38, p 3408CrossRef

S. Bader, W. Gust, and H. Hieber, Rapid formation of Intermetallic Compounds Interdiffusion in the Cu-Sn and Ni-Sn Systems, Acta Metall. Mater., 1995, 43, p 329–337

M. Schaefer, R.A. Fournelle, and J. Liang, Theory for Intermetallic Phase Growth Between Cu and Liquid Sn–Pb Solder Based on Grain Boundary Diffusion Control, J. Electron. Mater., 1998, 27, p 1167–1176CrossRef

10.

P.G. Harris and K.S. Chaggar, The Role of Intermetallic Compounds in Lead-Free Soldering, Solder. Surf. Mount Technol., 1998, 10, p 38–52CrossRef

11.

K.N. Tu, Interdiffusion and Reaction in Bimetallic Cu-Sn Thin Films, Acta Metall., 1973, 21, p 347–354CrossRef

12.

K.N. Tu, Cu/Sn Interfacial Reactions: Thin-Film Case Versus Bulk Case, Mater. Chem. Phys., 1996, 46, p 217–223CrossRef

13.

F. Dheurle, C.S. Petersson, J.E.E. Baglin, S.J. La Placa, and C.Y. Wong, Formation of Thin Films of NiSi: Metastable Structure, Diffusion Mechanisms in Intermetallic Compounds, J. Appl. Phys., 1984, 55, p 4208–4218CrossRef

14.

U. Gösele and K.N. Tu, Growth Kinetics of Planar Binary Diffusion Couples: “Thin-Film Case’ Versus “Bulk Cases”, J. Appl. Phys., 1989, 53, p 3252–3260CrossRef

Title: Suppression of Interdiffusion in Copper/Tin Thin Films
Authors: Harald Etschmaier
Holger Torwesten
Hannes Eder
Peter Hadley
Publication date: 01-08-2012
Publisher: Springer US
Published in: Journal of Materials Engineering and Performance / Issue 8/2012
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI: https://doi.org/10.1007/s11665-011-0090-2

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