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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 11/2014

01-11-2014

The effects of Mn powder additions on the microstructures and tensile property of SnAgCu/Cu solder joints

Authors: Jun Shen, Peipei He, Tao Zhang, Yang Li, Yayun Pu, Jie Chen

Published in: Journal of Materials Science: Materials in Electronics | Issue 11/2014

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Abstract

In this paper, the effects of Mn powder on fusion property of Sn3.0Ag0.5Cu solder alloy and microstructures as well as tensile property of the solder joints of Sn3.0Ag0.5Cu/Cu were investigated by differential scanning calorimetry analysis, scanning electron microscopy and tensile tests. The results showed that the addition of Mn dramatically suppressed under cooling of SnAgCu solder alloy. Mn addition contributed to the growth of Cu6Sn5 intermetallic compound layers since it provided nucleation sites for Cu6Sn5 at the solder joints. Moreover, Mn addition increased the hardness of the solder alloys and reduced the tensile strength of SnAgCu/Cu solder joints. During aging, the growth of IMC layers of SnAgCuMn/Cu solder joints was slower than that of SnAgCu/Cu solder joints, and the tensile strength of all the solder joints increased after aging.
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Metadata
Title
The effects of Mn powder additions on the microstructures and tensile property of SnAgCu/Cu solder joints
Authors
Jun Shen
Peipei He
Tao Zhang
Yang Li
Yayun Pu
Jie Chen
Publication date
01-11-2014
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 11/2014
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2233-3

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