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Published in: Journal of Materials Science: Materials in Electronics 3/2018

09-11-2017

The sputtering of AlN films on top of on- and off-axis 3C-SiC (111)/Si (111) substrates at various substrate temperatures

Authors: A. Iqbal, G. Walker, L. Hold, A. Fernandes, P. Tanner, A. Iacopi, F. Mohd-Yasin

Published in: Journal of Materials Science: Materials in Electronics | Issue 3/2018

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Abstract

AlN thin films have been sputtered on top of the on-axis and 4° off-axis 3C-SiC (111)/Si (111) substrates at various substrate temperatures. The grazing angle incident XRD scans show that all films have major peak at (002) plane and minor peaks at (101) and (102) planes. The AlN films are further characterized in terms of the FWHM of the rocking curve, surface morphology and deposition rate. We observed that the increasing substrate temperature improve the crystal quality of the AlN (002) films, but it has minimal impact on the surface roughness and deposition rate. We also extracted the values for the bi-axial stress, the grain size and the piezoelectric coefficient. Overall, the off-axis 3C-SiC/Si (111) substrates provide a better template for the sputtering of AlN (002) films in term of better crystal quality, lower surface roughness and lower bi-axial stress.

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Metadata
Title
The sputtering of AlN films on top of on- and off-axis 3C-SiC (111)/Si (111) substrates at various substrate temperatures
Authors
A. Iqbal
G. Walker
L. Hold
A. Fernandes
P. Tanner
A. Iacopi
F. Mohd-Yasin
Publication date
09-11-2017
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 3/2018
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-017-8163-0

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