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International Journal of Material Forming
Published in: International Journal of Material Forming 5/2021

15-03-2021 | Original Research

The superplastic forming/diffusion bonding and mechanical property of TA15 alloy for four‐layer hollow structure with squad grid

Authors: Zhihao Du, Kaifeng Zhang

Published in: International Journal of Material Forming | Issue 5/2021

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Abstract

The superplastic forming/diffusion bonding (SPF/DB) process has been widely applied to manufacture the multi-layer components. In this paper, a four-layer hollow structure with squad grid was fabricated by SPF/DB process. The superplastic behavior of TA15 alloy was investigated by the uni-axial tensile tests at high temperature, and the maximum elongation of 911 % was obtained at 920 °C/0.001 s− 1. The finite element method (FEM) of the four-layer structure was conducted, and the results showed that TA15 alloy was appropriate for fabricating this complex-shaped structure. Then the four-layer hollow structure was successfully fabricated by SPF/DB process at 920 °C with the target strain rate of 0.001 s− 1. Finally, the microstructure, thickness distribution and mechanical property of the four-layer hollow structure were investigated. The grain size increased from 5 μm to 10 μm and the sound bonding interface was achieved. The thickness distribution was symmetrical in height direction. The compressive strength and the maximum bending load of the four-layer hollow structure was 50 MPa and 64.4 kN, respectively.
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Metadata
Title
The superplastic forming/diffusion bonding and mechanical property of TA15 alloy for four‐layer hollow structure with squad grid
Authors
Zhihao Du
Kaifeng Zhang
Publication date
15-03-2021
Publisher
Springer Paris
Published in
International Journal of Material Forming / Issue 5/2021
Print ISSN: 1960-6206
Electronic ISSN: 1960-6214
DOI
https://doi.org/10.1007/s12289-021-01621-z

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