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Published in: Microsystem Technologies 4-5/2014

01-04-2014 | Technical Paper

Thermal actuators featuring large displacements for passive temperature sensing

Authors: H. Steiner, W. Hortschitz, M. Stifter, F. Keplinger, T. Sauter

Published in: Microsystem Technologies | Issue 4-5/2014

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Abstract

The thermal actuator presented in this paper consists of two symmetrically V-shaped beam stacks, where each stack consists of six beams in parallel. The stacks are coupled facing each other and slightly shifted along the mirror axis. Both stacks are connected to a lever beam and fixed at four anchor regions to the substrate. Due to the difference in the coefficient of thermal expansion of the material of the beams and the one of the substrate, the tip of the lever moves perpendicular to the mirror axis. The device is fabricated from galvanic deposited nickel on a silicon substrate. Finite element simulations were carried out to optimize the design with respect to the sensitivity and the maximum mechanical stress. The stress needs to be lower than the yield strength of the material. Otherwise, plastic deformations of the beams would lead to irreversible deflections of the beam tip. This limits the overall sensitivity of the design. First results of the device with 400 μm long bent beams show a linear behavior and a sensitivity of 0.5 μm/K and forces of 66 μN/K for a temperature range of −30 °C up to +40 °C.

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Metadata
Title
Thermal actuators featuring large displacements for passive temperature sensing
Authors
H. Steiner
W. Hortschitz
M. Stifter
F. Keplinger
T. Sauter
Publication date
01-04-2014
Publisher
Springer Berlin Heidelberg
Published in
Microsystem Technologies / Issue 4-5/2014
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-013-1990-x

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