Thermal analysis and mechanical properties of Sn–1.0Ag–0.5Cu solder alloy after modification with SiC nano-sized particles

The size and morphology of intermetallic compounds (IMCs) of Sn–1.0Ag–0.5Cu (SAC105) solder alloys can have a significant influence on the mechanical strength of solder joints. The aim of the present study is to investigate the influence of SiC nano-particles addition on the microstructure, thermal behavior, and corresponding mechanical properties of SAC(105) solder alloys. Results show that the addition of SiC nanoparticles into the SAC(105) alloy melt prompts the formation of primary β-Sn phase with small sub-grain size in the solidified structure. The SiC nanoparticles can offer an additional nucleation sites for the formation of refined Ag₃Sn and Cu₆Sn₅ IMCs. The hard SiC particles and refined IMCs with small spacing could obstruct the dislocation slipping and thus, lead to a strong dispersion strengthening mechanism in the composite solder. As a result, the composite SAC(105)/SiC solder displayed a higher ultimate tensile strength and 0.2 % yield strength (0.2 %YS) than that of plain SAC(105) solder. The addition of SiC nano-sized particles can also effectively reduce the undercooling and pasty range, while the melting temperature is maintained at the SAC(105) level, indicating that the novel composite solder is fit for existing soldering process.