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Microsystem Technologies
Published in: Microsystem Technologies 8/2017

31-01-2017 | Technical Paper

Wafer-level vacuum-encapsulated rate gyroscope with high quality factor in a commercial MEMS process

Authors: Adel Merdassi, Mohamad Nizar Kezzo, Vamsy P. Chodavarapu

Published in: Microsystem Technologies | Issue 8/2017

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Abstract

We report the design and fabrication of a rate gyroscope sensor that is characterized by a high quality factor (52,300), unmatched resonance mode and low noise performance. The gyroscope dimensions are 1800 µm × 850 µm with 30 µm device thickness. The gyroscope comprises of a symmetrical resonator for the drive mode oscillation and uses differential capacitance measurement for inertial sensing. The gyroscope is fabricated using MEMS Integrated Design for Inertial Sensors process, which is a new microfabrication process developed by Teledyne DALSA Semiconductor Inc. This new microfabrication technology offers wafer-level encapsulation under high vacuum pressure of 10 mTorr and includes Through Silicon Vias that allows flip-chip bonding with an integrated circuit for signal detection and processing. The fabricated gyroscope was tested and it exhibited a sensitivity of 0.8 fF/°/s with excellent linearity over a wide input angular velocity range of ±1000°/s and a high rate resolution of 0.71°/s.
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Literature
Acar C, Shkel A (2009) MEMS vibratory gyroscopes: structural Approaches to improve robustness, 2nd edn. Springer, New YorkCrossRef
Acar C, Schofield AR, Trusov AA, Costlow LE, Shkel AM (2009) Environmentally robust MEMS vibratory gyroscopes for automotive applications. IEEE Sens J 9:1895–1906CrossRef
Ahn CH, Nitzan S, Ng EJ, Hong VA, Yang Y, Kimbrell T et al (2014) Encapsulated high frequency (235 kHz), high-Q (100 k) disk resonator gyroscope with electrostatic parametric pump. Appl Phys Lett 105:243504CrossRef
Ayazi F (2011) Multi-DOF inertial MEMS: from gaming to dead reckoning. In: Solid-state sensors, actuators and microsystems conference (TRANSDUCERS), 2011 16th International pp 2805–2808
Bogue R (2007) Resonating gyroscopes: the next big challenge for MEMS technology. Sens Rev 27:197–199CrossRef
Candler RN, Hopcroft MA, Kim B, Park WT, Melamud R, Agarwal M et al (2006) Long-term and accelerated life testing of a novel single-wafer vacuum encapsulation for MEMS resonators. J Microelectromech Syst 15:1446–1456CrossRef
Cho JY, Woo JK, Yan JL, Peterson RL, Najafi K (2014) Fused-silica micro birdbath resonator gyroscope (mu-BRG). J Microelectromech Syst 23:66–77CrossRef
Choa SH (2005) Reliability of vacuum packaged MEMS gyroscopes. Microelectron Reliab 45:361–369CrossRef
Collin J (2015) MEMS IMU carouseling for ground vehicles. IEEE Trans Veh Technol 64:2242–2251CrossRef
Comi C, Corigliano A, Langfelder G, Longoni A, Tocchio A, Simoni B (2010) A resonant microaccelerometer with high sensitivity operating in an oscillating circuit. IEEE J Microelectromech Syst 19(5):1140–1152CrossRef
Gooch R, Schimert T, McCardel W, Ritchey B, Gilmour D, Koziarz W (1999) Wafer-level vacuum packaging for MEMS. J Vac Sci Technol A Vac Surf Films 17:2295–2299CrossRef
Guan J-P, Liu X-M (2010) Improved design and modeling of micromachined tuning fork gyroscope characterized by high quality factor. J Electron Sci Technol 8:280–286
Guo ZS, Cheng FC, Li BY, Cao L, Lu C, Song K (2015) Research development of silicon MEMS gyroscopes: a review. Microsyst Technol Micro Nanosyst Inform Stor Process Syst 21:2053–2066
Jeong Y, Serrano DE, Keesara V, Sung WK, Ayazi F (2013) Wafer-level vacuum-packaged tri-axial accelerometer with nano airgaps. In: 26th IEEE international conference on micro electro mechanical systems (MEMS 2013), pp 33–36
Johari H, Ayazi F (2007) High-frequency capacitive disk gyroscopes in (100) and (111) silicon. In: Proceedings of the IEEE twentieth annual international conference on micro electro mechanical systems 1–2: 238–241
Kempe V (2011) Inertial MEMS: principles and practice, 1st edn. Cambridge University Press, United KingdomCrossRef
Lawrence A (1998) Modern inertial technology: navigation, guidance, and control, 2nd edn. Springer, New YorkCrossRef
Lee B, Seok S, Chun K (2003) A study on wafer level vacuum packaging for MEMS devices. J Micromech Microeng 13:663–669CrossRef
Lee SH, Mitchell J, Welch W, Lee S, Najafi K (2010) Wafer-level vacuum/hermetic packaging technologies for MEMS. Reliab Packag Test Charact MEMS/Moems Nanodevices Ix 7592
Mansoor H, Zeng H, Chen K, Yu Y, Zhao J, Chiao M (2011) Vertical optical sectioning using a magnetically driven confocal microscanner aimed for in vivo clinical imaging. Opt Expr 19:25161–25172CrossRef
Merdassi A, Yang P, Chodavarapu VP (2015a) A wafer level vacuum encapsulated capacitive accelerometer fabricated in an unmodified commercial MEMS process. Sensors 15:7349–7359CrossRef
Merdassi A, Kezzo MN, Xereas G, Chodavarapu VP (2015b) Wafer level vacuum encapsulated tri-axial accelerometer with low cross-axis sensitivity in a commercial MEMS process. Sens Actuators A Phys 236:25–37CrossRef
Mizuno J, Nottmeyer K, Kobayashi T, Minami K, Esashi M (1997) Silicon bulk micromachined accelerometer with simultaneous linear and angular sensitivity. IEEE International Conference on Solid State Sensors and Actuators 2:1197–1200
Pai P, Chowdhury FK, Mastrangelo CH, Tabib-Azar M (2012) MEMS-based hemispherical resonator gyroscopes. In: 2012 IEEE sensors proceedings, pp 170–173
Premachandran CS, Chong SC, Liw S, Nagarajan R (2009) Fabrication and testing of a wafer-level vacuum package for MEMS device. IEEE Trans Adv Packag 32:486–490CrossRef
Prikhodko IP, Zotov SA, Trusov AA, Shkel AM (2011) Sub-degree-per-hour silicon MEMS rate sensor with 1 million Q-factor. In: Solid-state sensors, actuators and microsystems conference (TRANSDUCERS), 2011 16th International, pp 2809–2812
Prikhodko IP, Trusov AA, Shkel AM (2012) North-finding with 0.004 radian precision using a silicon MEMS quadruple mass gyroscope with Q-factor of 1 million. In: 2012 IEEE 25th international conference on micro electro mechanical systems (MEMS)
Prikhodko IP, Zotov SA, Trusov AA, Shkel AM (2013) What is MEMS gyrocompassing? Comparative analysis of maytagging and carouseling. J Microelectromech Syst 22:1257–1266CrossRef
Rozelle DM (2009) The hemispherical resonator gyro: from wineglass to the planets. In: 19th AAS/AIAA space flight mechanics meeting, Savannah, pp 1157–1178
Sharma M, Sarraf EH, Baskaran R, Cretu E (2012) Parametric resonance: amplification and damping in MEMS gyroscopes. Sens Actuators A Phys 177:79–86CrossRef
Sokolovic V, Dikic G, Markovic G, Stancic R, Lukic N (2015) INS/GPS navigation system based on MEMS technologies. Stroj Vestn J Mech Eng 61:448–458CrossRef
Tan C-W, Park S, Mostov K, Varaiya P (2001) Design of gyroscope-free navigation systems. In: Proceedings IEEE intelligent transportation systems. Oakland, CA, pp 286–291
Torunbalci MM, Alper SE, Akin T (2014) Wafer level hermetic encapsulation of MEMS inertial sensors using SOI cap wafers with vertical feedthroughs. In: 2014 1st IEEE international symposium on inertial sensors and systems (Isiss 2014), pp 153–154
Torunbalci MM, Alper SE, Akin T (2015a) Wafer level hermetic sealing of MEMS devices with vertical feedthroughs using anodic bonding. Sens Actuators A Phys 224:169–176CrossRef
Torunbalci MM, Alper SE, Akin T (2015b) Advanced MEMS process for wafer level hermetic encapsulation of MEMS devices using SOI cap wafers with vertical feedthroughs. J Microelectromech Syst 24:556–564CrossRef
Torunbalci MM, Alper SE, Akin T (2015c) A method for wafer level hermetic packaging of SOI-MEMS devices with embedded vertical feedthroughs using advanced MEMS process. J Micromech Microeng 25:125030CrossRef
Trusov AA, Atikyan G, Rozelle DM, Meyer AD, Zotov SA, Simon BR, et al. (2014) Flat is not dead: current and future performance of Si-MEMS quad mass gyro (QMG) system. In: 2014 Ieee/Ion position, location and navigation symposium—plans, pp 252–258
Xereas G, Chodavarapu VP (2015) Wafer-level vacuum-encapsulated lame mode resonator with f-Q product of 2.23 × 10(13) Hz. IEEE Electron Device Lett 36:1079–1081CrossRef
Zeng HS, Zhao Y (2011) Sensing movement: microsensors for body motion measurement. Sensors 11:638–660CrossRef
Zhang K, Jiang W, Li XX (2008) Wafer-level sandwiched packaging for high-yield fabrication of high-performance MEMS inertial sensors. In: MEMS 2008: 21st IEEE international conference on micro electro mechanical systems, technical digest, pp 814–817
Metadata
Title
Wafer-level vacuum-encapsulated rate gyroscope with high quality factor in a commercial MEMS process
Authors
Adel Merdassi
Mohamad Nizar Kezzo
Vamsy P. Chodavarapu
Publication date
31-01-2017
Publisher
Springer Berlin Heidelberg
Published in
Microsystem Technologies / Issue 8/2017
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-016-3250-3

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