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Published in: Journal of Materials Science: Materials in Electronics 17/2020

29-07-2020

A comparative study on the electrical properties and conduction mechanisms of Au/n-Si Schottky diodes with/without an organic interlayer

Authors: Ayşegül Eroğlu, Selçuk Demirezen, Yashar Azizian-Kalandaragh, Şemsettin Altındal

Published in: Journal of Materials Science: Materials in Electronics | Issue 17/2020

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Abstract

In order to see an interlayer on the electrical parameters and conduction mechanisms (CMs), both the metal–semiconductor (MS) and Au/(MgO-PVP)/n-Si Schottky diodes (SDs) were grown onto the same wafer with   〈100〉 orientation and 350 μm thickness. Next, their electrical parameters, such as the ideality factor (n), barrier height (ΦB), and series resistances (Rs) were obtained from the current–voltage (I–V) measurements using thermionic emissions, theory, and Cheung and Norde functions and compared. The energy-dependent distribution of interface traps/states (Dit/Nss) of these two structures were extracted from the I–V data in the forward biases by considering the voltage-dependent n and ΦB. Experimental results confirmed that the Nss for a metal–polymer–semiconductor is considerably lower than for an MS, and it increases from the mid-gap towards the edge of the conduction band (Ec). The ln(I)–ln(V) curves have three straight lines which correspond to low, moderate, and high biases, and CM is governed by ohmic, trap/space-charge-limited current, respectively. When comparing these results, MgO-PVP leads to considerably improving the performance of the MS in respect of lower values of Nss, Rs, the reverse saturation current (Io) and higher values of the rectifying rate, ΦB, and the shunt resistance (Rsh), and hence it can be successfully used instead of a traditional insulator interlayer.

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Literature
1.
go back to reference S.M. Sze, Physics of Semiconductor Devices, 2nd edn. (Wiley, New York, 1981) S.M. Sze, Physics of Semiconductor Devices, 2nd edn. (Wiley, New York, 1981)
2.
go back to reference E.H. Rhoderick, Metal-Semiconductor Contacts (Clarendon, Oxford, 1978) E.H. Rhoderick, Metal-Semiconductor Contacts (Clarendon, Oxford, 1978)
3.
go back to reference B.L. Sharma, Metal-Semiconductor Schottky Barrier Junctions and Their Applications (Plenum, New York, 1984)CrossRef B.L. Sharma, Metal-Semiconductor Schottky Barrier Junctions and Their Applications (Plenum, New York, 1984)CrossRef
5.
go back to reference V. Janardhanam, A.A. Kumar, V.R. Reddy, P.N. Reddy, J. Alloys Compd. 485, 467 (2009)CrossRef V. Janardhanam, A.A. Kumar, V.R. Reddy, P.N. Reddy, J. Alloys Compd. 485, 467 (2009)CrossRef
6.
go back to reference K. Ejderha, N. Yıldırım, B. Abay, A. Turut, J. Alloys Compd. 484, 870 (2009)CrossRef K. Ejderha, N. Yıldırım, B. Abay, A. Turut, J. Alloys Compd. 484, 870 (2009)CrossRef
8.
go back to reference A. Latreche, Z. Ouennoughi, A. Sellai, R. Weiss, H. Ryssel, Semicond. Sci. Technol. 26, 085003 (2011)CrossRef A. Latreche, Z. Ouennoughi, A. Sellai, R. Weiss, H. Ryssel, Semicond. Sci. Technol. 26, 085003 (2011)CrossRef
9.
go back to reference V. Janardhanam, I. Jyothi, K.-S. Ahn, C.-J. Choi, Thin Solid Films 546, 63 (2013)CrossRef V. Janardhanam, I. Jyothi, K.-S. Ahn, C.-J. Choi, Thin Solid Films 546, 63 (2013)CrossRef
11.
go back to reference E.E. Said-Galiev, A.I. Stakhanov, I.V. Blagodatskikh, E.M. Kobitskaya, A.R. Khokhlov, A.V. Naumkin, I.O. Volkov, V.V. Volkov, E.V. Shtykova, K.A. Dembo, S.A. Pisarev, Polym. Sci. Ser. B 52, 165 (2010)CrossRef E.E. Said-Galiev, A.I. Stakhanov, I.V. Blagodatskikh, E.M. Kobitskaya, A.R. Khokhlov, A.V. Naumkin, I.O. Volkov, V.V. Volkov, E.V. Shtykova, K.A. Dembo, S.A. Pisarev, Polym. Sci. Ser. B 52, 165 (2010)CrossRef
12.
go back to reference M.S.P. Reddy, K. Sreenu, V.R. Reddy, C. Park, J. Mater. Sci. Mater. Electron. 28, 4847 (2017)CrossRef M.S.P. Reddy, K. Sreenu, V.R. Reddy, C. Park, J. Mater. Sci. Mater. Electron. 28, 4847 (2017)CrossRef
13.
go back to reference E.E. Tanrıkulu, S. Demirezen, Ş. Altındal, İ. Uslu, J. Mater. Sci. Mater. Electron. 28, 8844 (2017)CrossRef E.E. Tanrıkulu, S. Demirezen, Ş. Altındal, İ. Uslu, J. Mater. Sci. Mater. Electron. 28, 8844 (2017)CrossRef
14.
go back to reference H.G. Çetinkaya, Ş. Altındal, I. Orak, I. Uslu, J. Mater. Sci. Mater. Electron. 28, 7905 (2017)CrossRef H.G. Çetinkaya, Ş. Altındal, I. Orak, I. Uslu, J. Mater. Sci. Mater. Electron. 28, 7905 (2017)CrossRef
15.
17.
go back to reference A.A. Al-Ghamdi, A. Dere, A. Tataroğlu, B. Arif, F. Yakuphanoglu, F. El-Tantawy, W.A. Farooq, J. Alloys Compd. 650, 692 (2015)CrossRef A.A. Al-Ghamdi, A. Dere, A. Tataroğlu, B. Arif, F. Yakuphanoglu, F. El-Tantawy, W.A. Farooq, J. Alloys Compd. 650, 692 (2015)CrossRef
18.
go back to reference A. Tataroğlu, A.G. Al-Sehemi, M. Ilhan, A.A. Al-Ghamdi, F. Yakuphanoglu, Silicon 10, 913 (2018)CrossRef A. Tataroğlu, A.G. Al-Sehemi, M. Ilhan, A.A. Al-Ghamdi, F. Yakuphanoglu, Silicon 10, 913 (2018)CrossRef
19.
go back to reference C.A. Amorim, E.P. Bernardo, E.R. Leite, A.J. Chiquito, Semicond. Sci. Technol. 33, 055003 (2018)CrossRef C.A. Amorim, E.P. Bernardo, E.R. Leite, A.J. Chiquito, Semicond. Sci. Technol. 33, 055003 (2018)CrossRef
20.
go back to reference C.V.S. Reddy, X. Han, Q.-Y. Zhu, L.-Q. Mai, W. Chen, Microelectron. Eng. 83, 281 (2006)CrossRef C.V.S. Reddy, X. Han, Q.-Y. Zhu, L.-Q. Mai, W. Chen, Microelectron. Eng. 83, 281 (2006)CrossRef
21.
go back to reference N. Rajeswari, S. Selvasekarapandian, S. Karthikeyan, M. Prabu, G. Hirankumar, H. Nithya, C. Sanjeeviraja, J. Non-Cryst. Solids 357, 3751 (2011)CrossRef N. Rajeswari, S. Selvasekarapandian, S. Karthikeyan, M. Prabu, G. Hirankumar, H. Nithya, C. Sanjeeviraja, J. Non-Cryst. Solids 357, 3751 (2011)CrossRef
22.
go back to reference R.T. De Silva, M.M.M.G.P.G. Mantilaka, K.L. Goh, S.P. Ratnayake, G.A.J. Amaratunga, K.M.N. de Silva, Int. J. Biomater. 2017, 1 (2017)CrossRef R.T. De Silva, M.M.M.G.P.G. Mantilaka, K.L. Goh, S.P. Ratnayake, G.A.J. Amaratunga, K.M.N. de Silva, Int. J. Biomater. 2017, 1 (2017)CrossRef
25.
go back to reference M.Y. Nassar, T.Y. Mohamed, I.S. Ahmed, I. Samir, J. Mol. Liq. 225, 730 (2017)CrossRef M.Y. Nassar, T.Y. Mohamed, I.S. Ahmed, I. Samir, J. Mol. Liq. 225, 730 (2017)CrossRef
26.
go back to reference G. Mohammed, A.M. El Sayed, W.M. Morsi, J. Phys. Chem. Solids 115, 238 (2018)CrossRef G. Mohammed, A.M. El Sayed, W.M. Morsi, J. Phys. Chem. Solids 115, 238 (2018)CrossRef
27.
go back to reference I.V. Mishakov, A.F. Bedilo, R.M. Richards, V.V. Chesnokov, A.M. Volodin, V.I. Zaikovskii, R.A. Buyanov, K.J. Klabunde, J. Catal. 206, 40 (2002)CrossRef I.V. Mishakov, A.F. Bedilo, R.M. Richards, V.V. Chesnokov, A.M. Volodin, V.I. Zaikovskii, R.A. Buyanov, K.J. Klabunde, J. Catal. 206, 40 (2002)CrossRef
28.
go back to reference S. Fakhri-Mirzanagh, K. Ahadzadeh-Namin, G.P. Givi, J. Farazin, Y. Azizian-Kalandaragh, Phys. B 583, 412064 (2020)CrossRef S. Fakhri-Mirzanagh, K. Ahadzadeh-Namin, G.P. Givi, J. Farazin, Y. Azizian-Kalandaragh, Phys. B 583, 412064 (2020)CrossRef
29.
go back to reference M. B. J., Emergent Research on Polymeric and Composite Materials (IGI Global, Hershey, 2018), pp. 209–224. M. B. J., Emergent Research on Polymeric and Composite Materials (IGI Global, Hershey, 2018), pp. 209–224.
31.
go back to reference H. Klug, L.E. Alexander, X-Ray Diffraction Procedures: For Polycrystalline and Amorphous Materials, 2nd edn. (Wiley, New York, 1974) H. Klug, L.E. Alexander, X-Ray Diffraction Procedures: For Polycrystalline and Amorphous Materials, 2nd edn. (Wiley, New York, 1974)
32.
go back to reference H.Y. Zahran, S.S. Shneouda, I.S. Yahia, F. El-Tantawy, J. Sol-Gel Sci. Technol. 86, 104 (2018)CrossRef H.Y. Zahran, S.S. Shneouda, I.S. Yahia, F. El-Tantawy, J. Sol-Gel Sci. Technol. 86, 104 (2018)CrossRef
33.
go back to reference S.S. Shenouda, H.Y. Zahran, I.S. Yahia, Mater. Res. Express 6, 105042 (2019)CrossRef S.S. Shenouda, H.Y. Zahran, I.S. Yahia, Mater. Res. Express 6, 105042 (2019)CrossRef
36.
go back to reference V.R. Reddy, V. Manjunath, V. Janardhanam, Y.-H. Kil, C.-J. Choi, J. Electron. Mater. 43, 3499 (2014)CrossRef V.R. Reddy, V. Manjunath, V. Janardhanam, Y.-H. Kil, C.-J. Choi, J. Electron. Mater. 43, 3499 (2014)CrossRef
39.
go back to reference H.C. Card, E.H. Rhoderick, J. Phys. D 4, 319 (1971) H.C. Card, E.H. Rhoderick, J. Phys. D 4, 319 (1971)
40.
go back to reference E.H. Nicollian, J.R. Brews, Metal Oxide Semiconductor (MOS) Physics and Technology (Wiley, New York, 1982) E.H. Nicollian, J.R. Brews, Metal Oxide Semiconductor (MOS) Physics and Technology (Wiley, New York, 1982)
Metadata
Title
A comparative study on the electrical properties and conduction mechanisms of Au/n-Si Schottky diodes with/without an organic interlayer
Authors
Ayşegül Eroğlu
Selçuk Demirezen
Yashar Azizian-Kalandaragh
Şemsettin Altındal
Publication date
29-07-2020
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 17/2020
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-020-04006-1

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