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Microsystem Technologies
Published in: Microsystem Technologies 4-5/2008

01-04-2008 | Technical Paper

A new micromachined sensor system for tactile measurements of high aspect ratio microstructures

Authors: M. Balke, E. Peiner, L. Doering

Published in: Microsystem Technologies | Issue 4-5/2008

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Abstract

A new tactile sensor with piezoresistive read-out is presented. The sensor is designed for measurements of high aspect ratio structures with a resolution of some 10 nm and a measuring range of hundreds of micrometer. Possible applications of the sensor are suggested. The silicon micromachining fabrication process is shown in detail next to the finite element simulations we performed. First measurements and a calibration process are described and the results are shown. The implementation into a measuring system is indicated.
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Literature
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Datskos PG, Thundat T, Lavrik NV (2004) Micro and nanocantilever sensors. Encyclodepia of Nanoscience and Nanotechnology, vol X, pp 1–10. ISBN 1-58883-001-2
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Kozlovskiy SI, Boiko II (2005) First-order piezoresistance coefficients in silicon crystals. Sens Actuators A 118:33–43CrossRef
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Tortonese M, Barrett RC, Quate CF (1993) Atomic resolution with an atomic force microscope using piezoresistive detection. Appl Phys Lett 62(8):234–236CrossRef
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Wilke N, Morrissey A, Ye S, O’Brian J (2004) Fabrication and characterisation of microneedle electrode arrays using wet etch technologies. EMN04, 20–21 October 2004, Paris, France
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Wilke N, Reed ML, Morrissey A (2006) The evolution from convex corner undercut towards microneedle formation: theory and experimental verification. J Micromech Microeng 16:808–814CrossRef
Metadata
Title
A new micromachined sensor system for tactile measurements of high aspect ratio microstructures
Authors
M. Balke
E. Peiner
L. Doering
Publication date
01-04-2008
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 4-5/2008
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-007-0452-8

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