Issue 2/2023
Special Issue: Advanced Package and Reliability
Content (12 Articles)
Global optimization of process parameters for low-temperature SiNx based on orthogonal experiments
Lian-Qiao Yang, Chi Zhang, Wen-Lei Li, Guo-He Liu, Majiaqi Wu, Jin-Qiang Liu, Jian-Hua Zhang
Manufacturability and mechanical reliability study for heterogeneous integration system in display (HiSID)
Hao-Hui Long, Hui-Cai Ma, Jia-Ying Gao, Li Zhang, De-Ming Zhang, Jian-Qiu Chen
Preparation and atmospheric wet-reflow of indium microbump for low-temperature flip-chip applications
Wen-Hui Zhu, Xiao-Yu Xiao, Zhuo Chen, Gui Chen, Ya-Mei Yan, Lian-Cheng Wang, Gang-Long Li
Conductive microsphere monolayers enabling highly conductive pressure-sensitive adhesive tapes for electromagnetic interference shielding
Xi Lu, Jin-Ming He, Ya-Dong Xu, Jian-Hong Wei, Jian-Hui Li, Hao-Hui Long, You-Gen Hu, Rong Sun
Optimal tool design in micro-milling of difficult-to-machine materials
Lorcan O’Toole, Feng-Zhou Fang
Application of sensor data based predictive maintenance and artificial neural networks to enable Industry 4.0
Jon Martin Fordal, Per Schjølberg, Hallvard Helgetun, Tor Øistein Skjermo, Yi Wang, Chen Wang
Improving the forming performance of incrementally formed sheet parts with customized heat treatment strategies
Hao Yuan, Yan-Le Li, Yuan-Yu Liu, Gang-Lin Zhao, Fang-Yi Li
A novel predict-prevention quality control method of multi-stage manufacturing process towards zero defect manufacturing
Li-Ping Zhao, Bo-Hao Li, Yi-Yong Yao
Novel gripper module and method for automated assembly of miniature parts
Zhi-Yong Zhang, Xiao-Dong Wang, Tong-Qun Ren, Tian-Lun Jin
Deformation characteristics and inertial effect of complex aluminum alloy sheet part under impact hydroforming: experiments and numerical analysis
Liang-Liang Xia, Shi-Hong Zhang, Yong Xu, Shuai-Feng Chen, Boris B. Khina, Artur I. Pokrovsky
Multiconditional machining process quality prediction using deep transfer learning network
Bo-Hao Li, Li-Ping Zhao, Yi-Yong Yao
Surface integrity of ball burnished bioresorbable magnesium alloy
G. V. Jagadeesh, Srinivasu Gangi Setti