Skip to main content
Top

Advances in Manufacturing

Issue 2/2023 Special Issue: Advanced Package and Reliability

Content (12 Articles)

Global optimization of process parameters for low-temperature SiNx based on orthogonal experiments

Lian-Qiao Yang, Chi Zhang, Wen-Lei Li, Guo-He Liu, Majiaqi Wu, Jin-Qiang Liu, Jian-Hua Zhang

Manufacturability and mechanical reliability study for heterogeneous integration system in display (HiSID)

Hao-Hui Long, Hui-Cai Ma, Jia-Ying Gao, Li Zhang, De-Ming Zhang, Jian-Qiu Chen

Preparation and atmospheric wet-reflow of indium microbump for low-temperature flip-chip applications

Wen-Hui Zhu, Xiao-Yu Xiao, Zhuo Chen, Gui Chen, Ya-Mei Yan, Lian-Cheng Wang, Gang-Long Li

Conductive microsphere monolayers enabling highly conductive pressure-sensitive adhesive tapes for electromagnetic interference shielding

Xi Lu, Jin-Ming He, Ya-Dong Xu, Jian-Hong Wei, Jian-Hui Li, Hao-Hui Long, You-Gen Hu, Rong Sun

Optimal tool design in micro-milling of difficult-to-machine materials

  • Open Access

Lorcan O’Toole, Feng-Zhou Fang

Application of sensor data based predictive maintenance and artificial neural networks to enable Industry 4.0

  • Open Access

Jon Martin Fordal, Per Schjølberg, Hallvard Helgetun, Tor Øistein Skjermo, Yi Wang, Chen Wang

Novel gripper module and method for automated assembly of miniature parts

Zhi-Yong Zhang, Xiao-Dong Wang, Tong-Qun Ren, Tian-Lun Jin

Deformation characteristics and inertial effect of complex aluminum alloy sheet part under impact hydroforming: experiments and numerical analysis

  • Open Access

Liang-Liang Xia, Shi-Hong Zhang, Yong Xu, Shuai-Feng Chen, Boris B. Khina, Artur I. Pokrovsky

Premium Partners