An Optimization Technique for Technological Modes of Thermoset Binder Hardening

A technique for optimizing the technology for the hardening of epoxy binders is presented. Temperature differences across the section of a hardened material sample are used as the optimization criterion. Calculations have been performed using the Femap NX Nastran software package. For the simulation, the values of thermal conductivity coefficients and heat capacity for different aggregative states of the material under study (liquid, gel-like, and solid state) have been used. Values for thermophysical properties and methods for their determination are presented. The optimization has been performed using an ideal point method. By means of the calculations, it is revealed that a heating mode is optimal wherein the temperature increases at a rate of 3 K/min before the gelation point and at a rate of 7 K/min after the gelation point.