Skip to main content
Disciplines
Automotive Business IT + Informatics Construction + Real Estate Electrical Engineering + Electronics Energy + Sustainability Insurance + Risk Finance + Banking Management + Leadership Marketing + Sales Mechanical Engineering + Materials
Events
DE
EN
Books
Journals
Topic Page
Marketing
Start single access now
Access for companies
EXTENDED SEARCH
Log in
Top
Microsystem Technologies
Published in: Microsystem Technologies 3/2013

01-03-2013 | Technical Paper

Application of photo-etching of polytetrafluoroethylene induced by high energy synchrotron radiation to LIGA

Authors: Hideki Kido, Tomoyuki Kuroki, Masaaki Okubo, Yuichi Utsumi

Published in: Microsystem Technologies | Issue 3/2013

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

Polytetrafluoroethylene (PTFE) microstructures’ processing characteristics using X-ray photo decomposition and desorption are studied in the highest energy region (2–12 keV). While the exposed surface states are seen melting and boiling from the remaining bubble structure of the irradiated surface, basic photochemistry of PTFE is also same as previous reports. Surface modification of PTFE from hydrophobic to hydrophilic was investigated in order to bond PTFE sheets to a brass substrate. Then, we have a successfully fabricated Ni microstructure by LIGA process using PTFE photo-etching using high energy X-ray. Proposed LIGA using SR-photo-etching of PTFE can simplify the total process, and it can ensure that dimensional errors remain small due to swelling in developer and electroplating bath.
previous article Special issue of the 9th high-aspect-ratio micro-structure technology workshop, HARMST 2011, in Hsinchu, Taiwan, June 12–18, 2011
next article Fabrication of high precision microstructure using ICP etching for capacitive inclination sensor

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

inform now
Literature
Becker EW, Eherfeld W, Hagmann P, Maner A, Münchmeyer D (1986) Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process). Microelectron Eng 4:35–56. doi:10.​1016/​0167-9317(86)90004-3 CrossRef
Simons JK, Frigo SP, Taylor JW, Rosenberg RA (1994) Synchrotron radiation (5–50 eV) induced degradation of fluorinated polymers. J Vac Sci Technol A 12:681–689. doi:10.​1116/​1.​578853 CrossRef
Utsumi Y, Kishimoto T (2005) Large area and wide dimension range X-ray lithography for lithographite, galvanoformung, and abformung process using energy variable synchrotron radiation. J Vac Sci Technol B 23:2903–2909. doi:10.​1116/​1.​2131880 CrossRef
Zhang Y, Katho T, Washio M, Yamada H, Hamada S (1995) High aspect ratio micromachining Teflon by direct exposure to synchrotron radiation. Appl Phys Lett 67:872–874. doi:10.​1063/​1.​115533 CrossRef
Metadata
Title
Application of photo-etching of polytetrafluoroethylene induced by high energy synchrotron radiation to LIGA
Authors
Hideki Kido
Tomoyuki Kuroki
Masaaki Okubo
Yuichi Utsumi
Publication date
01-03-2013
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 3/2013
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-012-1472-6

Other articles of this Issue 3/2013

Microsystem Technologies 3/2013 Go to the issue

Technical Paper

Vertical Si nanowire with ultra-high-aspect-ratio by combined top-down processing technique

Technical Paper

Fabrication of 3-D PTFE microstructures utilising change of etching rate with respect to exposure time

Technical Paper

Fabrication of flexible light guide plate using CO2 laser LIGA-like technology

Technical Paper

Application of the inclined exposure and molding process to fabricate a micro beam-splitter with nanometer roughness

Technical Paper

3D deep X-ray lithography for producing a multi-channel Fourier transform interferometer

Technical Paper

Fabrication of high precision microstructure using ICP etching for capacitive inclination sensor