Area Array Leverages: Why and How to Choose a Package

Performance is an attribute that defines how well a given requirement is satisfied and is predicated on priority so may depend upon one or a multiplicity of factors. Among those most often considered in microelectronic packaging are thermal and electrical characteristics, size, cost and reliability. The details of array technology at the die, module and board levels have been discussed in the preceding chapters. It is the purpose of this chapter to provide comparative data and some guidance in how to select a technology in consideration of the various options and strategies available based upon the application.