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History of Flip Chip and Area Array Technology Read chapter Read first chapter

2001 | OriginalPaper | Chapter

Interconnections for High-Frequency Applications

Author : K. Boustedt

Published in: Area Array Interconnection Handbook

Publisher: Springer US

Included in: Professional Book Archive

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The drive towards more and more wireless communication for various purposes increases the need for electronic packages capable of ever-higher operating frequencies. This chapter gives an overview of die and package interconnects suitable for high-frequency operation, i.e., GHz range. Of particular interest are the challenges in moving from more traditional interconnect methods to gallium arsenide flip-chip technology.

previous chapter Area Array Leverages: Why and How to Choose a Package
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Metadata
Title
Interconnections for High-Frequency Applications
Author
K. Boustedt
Copyright Year
2001
Publisher
Springer US
Book
Area Array Interconnection Handbook

Print ISBN: 978-1-4613-5529-8

Electronic ISBN: 978-1-4615-1389-6

Copyright Year: 2001

DOI
https://doi.org/10.1007/978-1-4615-1389-6_26