Thermal Performance

A robust package thermal design achieves many objectives. Although the primary objective is to maintain a proper module operating temperature range many other objectives must be realized simultaneously to be useful. The module thermal design must be integral with the system-thermal design, whether the system is a mainframe computer, personal computer, video game or a pager. Thermal-solution costs must be consistent with overall system costs. Thermal-solution components should be readily and commercially available, easily manufactured and inspectable for quality. They must be capable of surviving the rigors of card and system manufacturing, shipping, storage and use, often providing many years of subsequent service under radically changing environmental conditions with little or no maintenance. Many must be designed for disassembly for in-plant or in-field rework, reclaim or upgrade.