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Open Access 23-08-2019

Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies

Authors: Terho Kutilainen, Marko Pudas, Mark A. Ashworth, Tero Lehto, Liang Wu, Geoffrey D. Wilcox, Jing Wang, Paul Collander, Jussi Hokka

Title: Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies
Authors: Terho Kutilainen
Marko Pudas
Mark A. Ashworth
Tero Lehto
Liang Wu
Geoffrey D. Wilcox
Jing Wang
Paul Collander
Jussi Hokka
Publication date: 23-08-2019
Publisher: Springer US
Published in: Journal of Electronic Materials / Issue 11/2019
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI: https://doi.org/10.1007/s11664-019-07534-7