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Journal of Materials Science: Materials in Electronics

Published in:

01-06-2009

Development of lead-free Sn-3.5Ag/SnO₂ nanocomposite solders

Authors: P. Babaghorbani, S. M. L. Nai, M. Gupta

Published in: Journal of Materials Science: Materials in Electronics | Issue 6/2009

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Abstract

In the present study, feasibility of using SnO₂ as reinforcement in Sn-3.5Ag is assessed. Energy-efficient microwave assisted powder metallurgy route was used for synthesis of materials. Characterization results revealed that best combination of hardness and tensile strength was realized with 0.7 vol% of SnO₂ in solder matrix. An attempt is made to correlate mechanical properties of Sn-3.5Ag with the increasing presence of SnO₂ particulates at the nanometer length scale.

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Title: Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders
Authors: P. Babaghorbani
S. M. L. Nai
M. Gupta
Publication date: 01-06-2009
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 6/2009
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-008-9767-1

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