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Journal of Materials Science: Materials in Electronics

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18-08-2021

Dielectric and thermal properties of GFs/PTFE composites with hybrid fillers of Al₂O₃ and hBN for microwave substrate applications

Authors: Youhong Tan, Xueyu Yan, Cong Tang, Guanyu Lu, Kainan Xie, Jianxi Tong, Fancheng Meng

Published in: Journal of Materials Science: Materials in Electronics | Issue 18/2021

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Abstract

The alumina/hexagonal boron nitride/glass fibers cloth/Polytetrafluoroethylene (Al₂O₃–hBN/GFs/PTFE) composites were prepared by blending-impregnation followed by hot compression method, and the dielectric, thermal properties of the composites with various hBN fillers content (0–20 wt.%) were investigated. The results show that the thermal conductivity of the composites increase significantly, while the coefficient of thermal expansion (CTE) decrease gradually, with the hBN content increasing. Composite substrates with 20 wt.% hBN exhibited high thermal conductivity as 1.05 W m⁻¹ K⁻¹, which is 5.3 times that of pure PTFE. Such compositions may be a promising material in high thermal conductivity copper clad laminate.

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Title: Dielectric and thermal properties of GFs/PTFE composites with hybrid fillers of Al2O3 and hBN for microwave substrate applications
Authors: Youhong Tan
Xueyu Yan
Cong Tang
Guanyu Lu
Kainan Xie
Jianxi Tong
Fancheng Meng
Publication date: 18-08-2021
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 18/2021
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-021-06817-2

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