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Journal of Materials Science: Materials in Electronics
Erschienen in: Journal of Materials Science: Materials in Electronics 18/2021

18.08.2021

Dielectric and thermal properties of GFs/PTFE composites with hybrid fillers of Al2O3 and hBN for microwave substrate applications

verfasst von: Youhong Tan, Xueyu Yan, Cong Tang, Guanyu Lu, Kainan Xie, Jianxi Tong, Fancheng Meng

Erschienen in: Journal of Materials Science: Materials in Electronics | Ausgabe 18/2021

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Abstract

The alumina/hexagonal boron nitride/glass fibers cloth/Polytetrafluoroethylene (Al2O3–hBN/GFs/PTFE) composites were prepared by blending-impregnation followed by hot compression method, and the dielectric, thermal properties of the composites with various hBN fillers content (0–20 wt.%) were investigated. The results show that the thermal conductivity of the composites increase significantly, while the coefficient of thermal expansion (CTE) decrease gradually, with the hBN content increasing. Composite substrates with 20 wt.% hBN exhibited high thermal conductivity as 1.05 W m−1 K−1, which is 5.3 times that of pure PTFE. Such compositions may be a promising material in high thermal conductivity copper clad laminate.
Vorheriger Artikel Nano-crystalline powders and microwave dielectric properties of Zr0.8Sn0.2TiO4 ceramics derived using deep eutectic solvents
Nächster Artikel Structural, double Jonscher response and non-Debye-type relaxor behavior of Ba0.75Sr0.25Ti0.9Zn0.2O3 ceramic

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Metadaten
Titel
Dielectric and thermal properties of GFs/PTFE composites with hybrid fillers of Al2O3 and hBN for microwave substrate applications
verfasst von
Youhong Tan
Xueyu Yan
Cong Tang
Guanyu Lu
Kainan Xie
Jianxi Tong
Fancheng Meng
Publikationsdatum
18.08.2021
Verlag
Springer US
Erschienen in
Journal of Materials Science: Materials in Electronics / Ausgabe 18/2021
Print ISSN: 0957-4522
Elektronische ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-021-06817-2

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