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Published in: Journal of Materials Science: Materials in Electronics 8/2013

01-08-2013

Effect of Cu additions on morphology and optical properties of ZnO nanorod arrays by two-step method

Authors: Jianguo Lv, Feng Wang, Zhitao Zhou, Changlong Liu, Wanbing Gong, Xiaoshuang Chen, Gang He, Shiwei Shi, Xueping Song, Zhaoqi Sun, Feng Liu

Published in: Journal of Materials Science: Materials in Electronics | Issue 8/2013

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Abstract

ZnO, Zn0.9Cu0.1O, Zn0.8Cu0.2O and Zn0.7Cu0.3O nanorod arrays are produced via a two-step process including an initial sol–gel method followed by hydrothermal growth. Effects of the Cu on microstructure, surface topography and optical properties of the nanorod arrays were studied and discussed. The results indicate that the nanorod arrays with a highly preferred orientation along the c axis were obtained on glass substrate. The Zn0.7Cu0.3O possesses the maximum density of nanorod arrays of 6.0 × 109 cm−2. The optical band-gap energy E g decreases first and then increases with Cu additions increase. The broadening of the optical band-gap can be explained by Moss–Burstein effect. The Cu additions will effective enhance the violet emission and suppress the green emission. The violet and green emissions are likely due to the electron transition from the localized level below conduction band and oxygen vacancy to the valance band.

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Literature
1.
go back to reference Q.-P. Luo, B.-X. Lei, X.-Y. Yu, D.-B. Kuang, C.-Y. Su, J. Mater. Chem. 21, 8709–8714 (2011)CrossRef Q.-P. Luo, B.-X. Lei, X.-Y. Yu, D.-B. Kuang, C.-Y. Su, J. Mater. Chem. 21, 8709–8714 (2011)CrossRef
3.
go back to reference Y. He, J.A. Wang, X.B. Chen, W.F. Zhang, X.Y. Zeng, Q.W. Gu, J. Nanopart. Res. 12, 169–176 (2010)CrossRef Y. He, J.A. Wang, X.B. Chen, W.F. Zhang, X.Y. Zeng, Q.W. Gu, J. Nanopart. Res. 12, 169–176 (2010)CrossRef
4.
go back to reference J. Yoo, C.-H. Lee, Y.-J. Doh, H.S. Jung, G.-C. Yi, Appl. Phys. Lett. 94, 223113–223117 (2009)CrossRef J. Yoo, C.-H. Lee, Y.-J. Doh, H.S. Jung, G.-C. Yi, Appl. Phys. Lett. 94, 223113–223117 (2009)CrossRef
5.
go back to reference M.S. Kim, J.H. Han, D.H. Lee, O. Beom-Hoan, S.G. Lee, E.H. Lee, S.G. Park, Microelectron. Eng. 97, 130–133 (2012)CrossRef M.S. Kim, J.H. Han, D.H. Lee, O. Beom-Hoan, S.G. Lee, E.H. Lee, S.G. Park, Microelectron. Eng. 97, 130–133 (2012)CrossRef
6.
go back to reference I.C. Yao, P. Lin, T.Y. Tseng, IEEE Trans. Nanotechnol. 11, 746–750 (2012)CrossRef I.C. Yao, P. Lin, T.Y. Tseng, IEEE Trans. Nanotechnol. 11, 746–750 (2012)CrossRef
7.
9.
go back to reference C.C. Wu, D.S. Wuu, P.R. Lin, T.N. Chen, R.H. Horng, J. Nanosci. Nanotechnol. 10, 3001–3011 (2010)CrossRef C.C. Wu, D.S. Wuu, P.R. Lin, T.N. Chen, R.H. Horng, J. Nanosci. Nanotechnol. 10, 3001–3011 (2010)CrossRef
10.
go back to reference J. Huang, L. Hu, H.H. Zhang, J. Zhang, X.P. Yang, D.H. Li, L.P. Zhu, Z.Z. Ye, J. Cryst. Growth 351, 93–100 (2012)CrossRef J. Huang, L. Hu, H.H. Zhang, J. Zhang, X.P. Yang, D.H. Li, L.P. Zhu, Z.Z. Ye, J. Cryst. Growth 351, 93–100 (2012)CrossRef
11.
go back to reference S.Y. Gao, D.M. Li, Y.G. Li, X.Y. Lv, J.Z. Wang, H.T. Li, Q.J. Yu, F.Y. Guo, L.C. Zhao, J. Alloy. Compd. 539, 200–204 (2012)CrossRef S.Y. Gao, D.M. Li, Y.G. Li, X.Y. Lv, J.Z. Wang, H.T. Li, Q.J. Yu, F.Y. Guo, L.C. Zhao, J. Alloy. Compd. 539, 200–204 (2012)CrossRef
12.
go back to reference Q.F. Sun, Y. Lu, H.M. Zhang, D.J. Yang, J.S. Xu, J. Li, Y.X. Liu, J.T. Shi, Mater. Res. Innovat. 16, 326–331 (2012)CrossRef Q.F. Sun, Y. Lu, H.M. Zhang, D.J. Yang, J.S. Xu, J. Li, Y.X. Liu, J.T. Shi, Mater. Res. Innovat. 16, 326–331 (2012)CrossRef
13.
go back to reference J. Xu, P. Liu, S. Shi, X. Zhang, L. Wang, Z. Ren, L. Ge, L. Li, Appl. Surf. Sci. 258, 7118–7125 (2012)CrossRef J. Xu, P. Liu, S. Shi, X. Zhang, L. Wang, Z. Ren, L. Ge, L. Li, Appl. Surf. Sci. 258, 7118–7125 (2012)CrossRef
14.
go back to reference M. Shuai, L. Liao, H.B. Lu, L. Zhang, J.C. Li, D.J. Fu, J. Phys. D Appl. Phys. 41, 135010 (2008)CrossRef M. Shuai, L. Liao, H.B. Lu, L. Zhang, J.C. Li, D.J. Fu, J. Phys. D Appl. Phys. 41, 135010 (2008)CrossRef
15.
16.
go back to reference S.W. Xue, X.T. Zu, W.L. Zhou, H.X. Deng, X. Xiang, L. Zhang, H. Deng, J. Alloy. Compd. 448, 21–26 (2008)CrossRef S.W. Xue, X.T. Zu, W.L. Zhou, H.X. Deng, X. Xiang, L. Zhang, H. Deng, J. Alloy. Compd. 448, 21–26 (2008)CrossRef
17.
go back to reference M. Wang, K.E. Lee, S.H. Hahn, E.J. Kim, S. Kim, J.S. Chung, E.W. Shin, C. Park, Mater. Lett. 61, 1118–1121 (2007)CrossRef M. Wang, K.E. Lee, S.H. Hahn, E.J. Kim, S. Kim, J.S. Chung, E.W. Shin, C. Park, Mater. Lett. 61, 1118–1121 (2007)CrossRef
18.
go back to reference M. Gabas, S. Gota, J.R. Ramos-Barrado, M. Sanchez, N.T. Barrett, J. Avila, M. Sacchi, Appl. Phys. Lett. 86, 042103–042104 (2005)CrossRef M. Gabas, S. Gota, J.R. Ramos-Barrado, M. Sanchez, N.T. Barrett, J. Avila, M. Sacchi, Appl. Phys. Lett. 86, 042103–042104 (2005)CrossRef
19.
go back to reference Q.H. Li, D. Zhu, W. Liu, Y. Liu, X.C. Ma, Appl. Surf. Sci. 254, 2922–2926 (2008)CrossRef Q.H. Li, D. Zhu, W. Liu, Y. Liu, X.C. Ma, Appl. Surf. Sci. 254, 2922–2926 (2008)CrossRef
20.
go back to reference G. Xiao-Yong, L. Qing-Geng, F. Hong-Liang, L. Yu-Fen, L. Jing-Xiao, Thin Solid Films 517, 4684–4688 (2009)CrossRef G. Xiao-Yong, L. Qing-Geng, F. Hong-Liang, L. Yu-Fen, L. Jing-Xiao, Thin Solid Films 517, 4684–4688 (2009)CrossRef
21.
go back to reference A.Y. Oral, Z.B. Bahşi, M.H. Aslan, Appl. Surf. Sci. 253, 4593–4598 (2007)CrossRef A.Y. Oral, Z.B. Bahşi, M.H. Aslan, Appl. Surf. Sci. 253, 4593–4598 (2007)CrossRef
23.
24.
go back to reference J.P. Cheng, X.B. Zhang, Z.Q. Luo, Surf. Coat. Technol. 202, 4681–4686 (2008)CrossRef J.P. Cheng, X.B. Zhang, Z.Q. Luo, Surf. Coat. Technol. 202, 4681–4686 (2008)CrossRef
25.
go back to reference Y. Gong, T. Andelman, G. Neumark, S. O’Brien, I. Kuskovsky, Nanoscale Res. Lett. 2, 297–302 (2007)CrossRef Y. Gong, T. Andelman, G. Neumark, S. O’Brien, I. Kuskovsky, Nanoscale Res. Lett. 2, 297–302 (2007)CrossRef
26.
go back to reference K. Vanheusden, C.H. Seager, W.L. Warren, D.R. Tallant, J.A. Voigt, Appl. Phys. Lett. 68, 403–405 (1996)CrossRef K. Vanheusden, C.H. Seager, W.L. Warren, D.R. Tallant, J.A. Voigt, Appl. Phys. Lett. 68, 403–405 (1996)CrossRef
Metadata
Title
Effect of Cu additions on morphology and optical properties of ZnO nanorod arrays by two-step method
Authors
Jianguo Lv
Feng Wang
Zhitao Zhou
Changlong Liu
Wanbing Gong
Xiaoshuang Chen
Gang He
Shiwei Shi
Xueping Song
Zhaoqi Sun
Feng Liu
Publication date
01-08-2013
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 8/2013
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-013-1208-0

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