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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 21/2018

29-08-2018

Effect of electroplating parameters on electroplated Cu film and microvoid formation of solder joints

Authors: Yongqiang Wan, Xiaoli Liu, Xiaowu Hu, Zhixian Min, Guangbin Yi, Xiongxin Jiang, Yulong Li

Published in: Journal of Materials Science: Materials in Electronics | Issue 21/2018

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Abstract

The influences of electroplating parameters on electroplated Cu (EPC) film and void formation at the Sn3.0Ag0.5Cu (SAC305)/Cu interface were investigated. It is found that the size of Cu particles increased with the increase of current density or deposit thickness. The surface roughness of Cu films also increased with increasing current density. And the surface roughness of EPC films demonstrated decrement at first and then increment with the increase of deposit thickness. It is observed that the electrodeposition with higher current density or thicker Cu film tended to inhibit the growth of Cu(111) and favor the growth of Cu(220). After reflowing and thermal aging, the voiding level increased greatly as the current density and deposit thickness increased, and that total microvoid area increased gradually with increasing aging time for all electroplating conditions. Additionally, the variation in the current density and deposit thickness did not influence the intermetallic compound growth rate.
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Metadata
Title
Effect of electroplating parameters on electroplated Cu film and microvoid formation of solder joints
Authors
Yongqiang Wan
Xiaoli Liu
Xiaowu Hu
Zhixian Min
Guangbin Yi
Xiongxin Jiang
Yulong Li
Publication date
29-08-2018
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 21/2018
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-9955-6

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