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Published in: Journal of Materials Science: Materials in Electronics 21/2018

14-09-2018

Influence of stacking order and intermediate phase at low temperature on Cu2ZnSnS4 thin film formation for solar cell

Authors: Kwang-Soo Lim, Seong-Man Yu, Ki-Bong Nam, Qicheng Hu, Tae-Sik Oh, Ji-Beom Yoo

Published in: Journal of Materials Science: Materials in Electronics | Issue 21/2018

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Abstract

A stacking order of a precursor is one of the important factors that affects the quality of Cu2ZnSnS4 (CZTS) thin film. Understanding of the intermediate phase formation and its reaction mechanism can contribute to the design of a precursor to enhance the performance of CZTS solar cell. In this work, three precursors such as Zn/SnS/Cu, SnS/Cu/Zn, and SnS/Zn/Cu were designed based on previous studies. These precursors were treated for sulfurization process at 560 °C, and annealed at 300 °C for 30 min to investigate the reaction of intermediate phases. The annealed thin film from Zn/SnS/Cu precursor exhibited crystallized and uniform intermediate ternary phase of Cu2SnS3. This easy and uniform transformation to Cu2SnS3 phase as a whole at low temperature using Zn/SnS/Cu precursor resulted in relatively smooth surface of CZTS thin film after sulfurization at high temperature. In contrast, CZTS thin film from SnS/Cu/Zn or SnS/Zn/Cu precursor showed a rough surface morphology with loss of Zn content. A rough surface will degrade the contact between CZTS absorber and CdS buffer layers, resulting in decreased a device performance. Accordingly, CZTS solar cell device fabricated from Zn/SnS/Cu precursor achieved improved efficiency of 4.20%.

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Appendix
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Metadata
Title
Influence of stacking order and intermediate phase at low temperature on Cu2ZnSnS4 thin film formation for solar cell
Authors
Kwang-Soo Lim
Seong-Man Yu
Ki-Bong Nam
Qicheng Hu
Tae-Sik Oh
Ji-Beom Yoo
Publication date
14-09-2018
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 21/2018
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-018-9954-7

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