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Published in: Journal of Materials Science: Materials in Electronics 12/2016

04-08-2016

Effect of grain size on dielectric and piezoelectric properties of bismuth layer structure CaBi2Nb2O9 ceramics

Authors: Xiaoxia Tian, Shaobo Qu, Hua Ma, Zhibin Pei, Binke Wang

Published in: Journal of Materials Science: Materials in Electronics | Issue 12/2016

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Abstract

Micro- and nano-sized bismuth layer-structured CaBi2Nb2O9 (CBNO) powder were synthesized by traditional and hydrothermal synthesis, respectively. These CBNO powders were used as raw materials to prepare CBNO ceramics by ordinary sintering and dynamic-control temperature sintering. The microstructures of the samples were characterized by XRD and SEM. The piezoelectric properties and dielectric performance of the samples were measured. The effects of grain size on the phase structure, density, dielectric and piezoelectric properties were investigated. It was found that the pure, fine-grained CBNO ceramics with grain size of ~0.75 μm could be prepared by hydrothermal method combining with dynamic-control temperature sintering. Such preparation method could effectively control the length–diameter ratio of the grain of the bismuth layer-structured ceramics. Grain size reduction, which is beneficial to improve the density and the dielectric properties of the material, made the ceramics easier to be polarized with the decreased length–diameter ratio. The piezoelectric coefficient, d 33, of the fine-grained 0.75-μm CBNO ceramics was nearly three times compared with that of the 10-μm ceramics. Such size effect is attributed mainly to the grain size of the ceramics.

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Literature
1.
go back to reference H. Yan, H. Zhang, R. Ubic, M. Reece, J. Liu, Z. Shen, Z. Zhang, Adv. Mater. 17, 1261 (2005)CrossRef H. Yan, H. Zhang, R. Ubic, M. Reece, J. Liu, Z. Shen, Z. Zhang, Adv. Mater. 17, 1261 (2005)CrossRef
2.
3.
go back to reference X.X. Tian, S.B. Qu, Z.B. Pei, C.H. Tian, Z. Xu, Ferroelectrics 404, 127 (2010)CrossRef X.X. Tian, S.B. Qu, Z.B. Pei, C.H. Tian, Z. Xu, Ferroelectrics 404, 127 (2010)CrossRef
4.
go back to reference C.M. Wang, S.J. Zhang, J.F. Wang, M.L. Zhao, C.L. Wang, Mater. Chem. Phys. 118, 21 (2009)CrossRef C.M. Wang, S.J. Zhang, J.F. Wang, M.L. Zhao, C.L. Wang, Mater. Chem. Phys. 118, 21 (2009)CrossRef
5.
go back to reference A.Z. Simões, A. Ries, C.S. Riccardi, A.H.M. Gonzalez, E. Longo, J.A. Varela, J. Appl. Phys. 100, 074110 (2006)CrossRef A.Z. Simões, A. Ries, C.S. Riccardi, A.H.M. Gonzalez, E. Longo, J.A. Varela, J. Appl. Phys. 100, 074110 (2006)CrossRef
6.
7.
8.
go back to reference H. Kniepkamp, W. Heywang, Z. Angew. Phys. 6, 385 (1954) H. Kniepkamp, W. Heywang, Z. Angew. Phys. 6, 385 (1954)
11.
go back to reference B. Jaffe, W.R. Cook, H. Jaffe, Piezoelectric Ceramics (Academic Press, London, 1971), pp. 53–114CrossRef B. Jaffe, W.R. Cook, H. Jaffe, Piezoelectric Ceramics (Academic Press, London, 1971), pp. 53–114CrossRef
12.
go back to reference C.A. Randall, N. Kim, J.P. Kucera, W. Cao, T.R. Shrout, J. Am. Ceram. Soc. 81, 677 (1998)CrossRef C.A. Randall, N. Kim, J.P. Kucera, W. Cao, T.R. Shrout, J. Am. Ceram. Soc. 81, 677 (1998)CrossRef
13.
go back to reference X.X. Tian, S.B. Qu, Z.B. Pei, B.K. Wang, H.L. Du, Z. Xu, J. Inorg. Organomet. Polym. 24, 355 (2014)CrossRef X.X. Tian, S.B. Qu, Z.B. Pei, B.K. Wang, H.L. Du, Z. Xu, J. Inorg. Organomet. Polym. 24, 355 (2014)CrossRef
16.
go back to reference G.A. Smolenskii, A.I. Agranovskaya, Sov. Phys. Tech. Phys. 3, 1380 (1958) G.A. Smolenskii, A.I. Agranovskaya, Sov. Phys. Tech. Phys. 3, 1380 (1958)
17.
go back to reference H.T. Zhang, H.X. Yan, H.P. Ning, M.J. Reece, M. Eriksson, Z.J. Shen, Y.M. Kan, P.L. Wang, Nanotechnology 20, 385708 (2009)CrossRef H.T. Zhang, H.X. Yan, H.P. Ning, M.J. Reece, M. Eriksson, Z.J. Shen, Y.M. Kan, P.L. Wang, Nanotechnology 20, 385708 (2009)CrossRef
18.
go back to reference X.X. Tian, F. Gao, S.B. Qu, H. Ma, B.K. Wang, J. Mater. Sci. Mater. Electron. 26, 6189 (2015)CrossRef X.X. Tian, F. Gao, S.B. Qu, H. Ma, B.K. Wang, J. Mater. Sci. Mater. Electron. 26, 6189 (2015)CrossRef
Metadata
Title
Effect of grain size on dielectric and piezoelectric properties of bismuth layer structure CaBi2Nb2O9 ceramics
Authors
Xiaoxia Tian
Shaobo Qu
Hua Ma
Zhibin Pei
Binke Wang
Publication date
04-08-2016
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 12/2016
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-016-5480-7

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