Skip to main content
Disciplines
Automotive Business IT + Informatics Construction + Real Estate Electrical Engineering + Electronics Energy + Sustainability Insurance + Risk Finance + Banking Management + Leadership Marketing + Sales Mechanical Engineering + Materials
Events
DE
EN
Books
Journals
Topic Page
Marketing
Start single access now
Access for companies
EXTENDED SEARCH
Log in
Top
Journal of Materials Engineering and Performance
Published in: Journal of Materials Engineering and Performance 4/2017

27-02-2017

Effect of Sulfide Concentration on Copper Corrosion in Anoxic Chloride-Containing Solutions

Authors: Decheng Kong, Chaofang Dong, Aoni Xu, Cheng Man, Chang He, Xiaogang Li

Published in: Journal of Materials Engineering and Performance | Issue 4/2017

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

The structure and property of passive film on copper are strongly dependent on the sulfide concentration; based on this, a series of electrochemical methods were applied to investigate the effect of sulfide concentration on copper corrosion in anaerobic chloride-containing solutions. The cyclic voltammetry and x-ray photoelectron spectroscopy analysis demonstrated that the corrosion products formed on copper in anaerobic sulfide solutions comprise Cu2S and CuS. And the corrosion resistance of copper decreased with increasing sulfide concentration and faster sulfide addition, owing to the various structures of the passive films observed by the atomic force microscope and scanning electron microscope. A p-type semiconductor character was obtained under all experimental conditions, and the defect concentration, which had a magnitude of 1022–1023 cm−3, increased with increasing sulfide concentration, resulting in a higher rate of both film growth and dissolution.
previous article Service Lifetime Estimation of EPDM Rubber Based on Accelerated Aging Tests
next article Corrosion Behavior of Copper-Clad Steel Bars with Unclad Two-End Faces for Grounding Grids in the Red Clay Soil

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

inform now
Literature
1.
F. King, Predicting the Lifetimes of Nuclear Waste Containers, J. Miner. Metals Mater. Soc., 2014, 66(3), p 526–537CrossRef
2.
A. Hedin, Semi-analytic Stereological Analysis of Waste Package/Fracture Intersections in a Granitic Rock Nuclear Waste Repository, Math. Geosci., 2008, 40(6), p 619–637CrossRef
3.
K. Birch, M.B. Belfadhel, J. Freire-Canosa et al., Technical Research and Development Program for Long-term Management of Canada’s Used Nuclear Fuel—Annual Report 2007. Canosa, 2007
4.
S.A. Tiren, P. Askling, and S. Wanstedt, Geologic Site Characterization for Deep Nuclear Waste Disposal in Fractured Rock Based on 3D Data Visualization, Eng. Geol., 1999, 52(s3–4), p 319–346CrossRef
5.
Hedin A, Kautsky U, Morén L et al., SR 97: Post-Closure Safety for a KBS 3 Deep Repository For Spent Nuclear Fuel—Overview. Mrs Online Proceeding Library, 1999, 663
6.
K. Pedersen, ChemInform Abstract: Microbial Processes in Radioactive Waste Disposal, Cheminform, 2001, 32(7), p 3–97
7.
SKB Swedish Nuclear Fuel and Waste Management Co., Long-term Safety for KBS-3 Repositories at Forsmark and Laxemar—A First Evaluation, Main Report of the SR-Can Project, SKB Technical Report, TR-06-09, 2006.
8.
F.X. Mao, C.F. Dong, S. Sharifi-Asl et al., Passivity Breakdown on Copper: Influence of Chloride Ion, Electrochim. Acta, 2014, 144, p 391–399CrossRef
9.
C.F. Dong, F.X. Mao, S.J. Gao et al., Passivity Breakdown on Copper: Influence of Temperature, J. Electrochem. Soc., 2016, 163, p C707–C717CrossRef
10.
D.D. Macdonald. Erratum: Theory of Steady-State Passive Films. J. Electrochem. Soc., 1992, 139(7)
11.
D.D. Macdonald, Passivity—the Key to Our Metals-Based Civilization, Pure Appl. Chem., 1999, 71(6), p 951–978CrossRef
12.
D.C. Kong, A.N. Xu, C.F. Dong et al., Electrochemical Investigation and ab Initio Computation of Passive Film Properties on Copper in Anaerobic Sulphide Solutions, Corros. Sci., 2016, 116, p 34–43CrossRef
13.
J. Chen, Z. Qin, and D.W. Shoesmith, Long-term Corrosion of Copper in a Dilute Anaerobic Sulphide Solution, Electrochim. Acta, 2011, 56(23), p 7854–7861CrossRef
14.
T. Martino, R. Partovi, J. Chen et al., Mechanisms of Film Growth on Copper in Aqueous Solutions Containing Sulphide and Chloride Under Voltammetric Conditions, Electrochim. Acta, 2014, 127(5), p 439–447CrossRef
15.
E.M. Khairy and N.A. Darwish, Studies on Copper-Semiconducting Layer-Electrolyte Systems—II. Galvanostatic Anodic Polarization of Cu/Cu2S/S2− Applying Stationary and Rectangular Pulse Techniques, Corros. Sci., 1973, 13(3), p 149–164CrossRef
16.
J. Chen, Z. Qin, and D.W. Shoesmith, Kinetics of Corrosion Film Growth on Copper in Neutral Chloride Solutions Containing Small Concentrations of Sulphide, J. Electrochem. Soc., 2010, 157(10), p C338–C345CrossRef
17.
Y. Ling, M. Taylor, S. Sharifi-Asl et al., The Semiconducting Properties and Impedance Analysis of Passive Films on Copper in Anoxic Sulphide-Containing Solutions from the Viewpoint of the Point Defect Model, ECS Trans., 2013, 50(31), p 53–67CrossRef
18.
M. Romand, M. Roubin, and J.P. Deloume, ESCA Studies of Some Copper and Silver Selenides, J. Electron Spectrosc. Relat. Phenom., 1978, 13(3), p 229–242CrossRef
19.
C.D. Wagner, Chemical Shifts of Auger Lines, and the Auger Parameter, Faraday Discuss. Chem. Soc., 1975, 60(60), p 291–300CrossRef
20.
V. Krylova and M. AndrulevicˇIus, Optical, XPS and XRD Studies of Semiconducting Copper Sulphide Layers on a Polyamide Film, Int. J. Photoenergy, 2009, 279(1), p 53–58
21.
D.L. Perry and J.A. Taylor, X-ray Photoelectron and Auger Spectroscopic Studies of Cu2S and CuS, J. Mater. Sci. Lett., 1986, 5(4), p 384–386CrossRef
22.
M.G. De Chialvo and A. Arvia, The Electrochemical Behaviour of Copper in Alkaline Solutions Containing Sodium Sulphide, J. Appl. Electrochem., 1985, 15, p 685–696CrossRef
23.
B.Y. Chang and S.M. Park, Electrochemical Impedance Spectroscopy, Annu. Rev. Anal. Chem., 2014, 55(1–2), p 349–365
24.
E. Sikora and D.D. Macdonald, Defining the Passive State, Solid State Ionics, 1997, 49, p 141–150CrossRef
25.
D.D. Macdonald, The History of the Point Defect Model for the Passive State: A Brief Review of Film Growth Aspects, Electrochim. Acta, 2011, 56(4), p 1761–1772CrossRef
26.
I. Grozdanov and M. Najdoski, Optical and Electrical Properties of Copper Sulphide Films of Variable Composition, J. Solid State Chem., 1995, 114(2), p 469–475CrossRef
27.
A. Fattah-Alhosseini, M.A. Golozar, A. Saatchi et al., Effect of Solution Concentration on Semiconducting Properties of Passive Films Formed on Austenitic Stainless Steels, Corros. Sci., 2010, 52, p 205–209CrossRef
28.
J.L. Lv and H.Y. Luo, Iushi Zhongguo Effect of Nano/Ultrafine Grain on Passive Film Properties of Metastable Austenitic Stainless Steels With and Without Loading, Mater. Chem. Phys., 2013, 139, p 674–680CrossRef
29.
J.L. Lv and H.Y. Luo, Electrochemical Investigation of Passive Film in Pre-deformation AISI, 304 Stainless Steels, Appl. Surf. Sci., 2012, 263, p 29–37CrossRef
30.
D.D. Macdonald, Some Personal Adventures in Passivity—A Review of the Point Defect Model for Film Growth, Russ. J. Electrochem., 2012, 48(3), p 235–258CrossRef
Metadata
Title
Effect of Sulfide Concentration on Copper Corrosion in Anoxic Chloride-Containing Solutions
Authors
Decheng Kong
Chaofang Dong
Aoni Xu
Cheng Man
Chang He
Xiaogang Li
Publication date
27-02-2017
Publisher
Springer US
Published in
Journal of Materials Engineering and Performance / Issue 4/2017
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI
https://doi.org/10.1007/s11665-017-2578-x

Other articles of this Issue 4/2017

Journal of Materials Engineering and Performance 4/2017 Go to the issue

OriginalPaper

Service Lifetime Estimation of EPDM Rubber Based on Accelerated Aging Tests

OriginalPaper

Microstructure Characterization and Corrosion Resistance Behavior of New Cobalt-Free Maraging Steel Produced Through ESR Techniques

OriginalPaper

Influence of Plastic Deformation on Martensitic Transformation During Hot Stamping of Complex Structure Auto Parts

OriginalPaper

Morphological and Electrochemical Study of Sulfide/Nitride Nanostructure Deposited Through Pulsed Plasma Electrolysis

OriginalPaper

Annealing Behavior at Triple Junctions in High-Purity Aluminum After Slight Cold Rolling

OriginalPaper

Diffusion Bonding of TA15 and Ti2AlNb Alloys: Interfacial Microstructure and Mechanical Properties

Premium Partners

    Image Credits