Skip to main content
Disciplines
Automotive Business IT + Informatics Construction + Real Estate Electrical Engineering + Electronics Energy + Sustainability Insurance + Risk Finance + Banking Management + Leadership Marketing + Sales Mechanical Engineering + Materials
Events
DE
EN
Books
Journals
Topic Page
Marketing
Start single access now
Access for companies
EXTENDED SEARCH
Log in
Top
Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 5/2008

01-05-2008

Effect of underfill on bending fatigue behavior of chip scale package

Authors: Bo-In Noh, Noh-Chang Park, Won-Sik Hong, Seung-Boo Jung

Published in: Journal of Materials Science: Materials in Electronics | Issue 5/2008

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

This study evaluated the mechanical behavior of chip scale packages (CSPs) with the underfills using the four-point bending test. The bending fatigue durability in the CSP increased with increasing glass transition temperature (T g ) of the underfill. The mechanical fatigue cracks occurred in the region between the (Ni,Cu)3Sn4 layer and the solder region near the upper substrate and the solder region of the CSP with the underfill which had the higher T g . However, these cracks occurred in the region between the (Ni,Cu)3Sn4 layer and the Ni3P layer near the bottom substrate and the solder region of the CSP with the underfill which had the lower T g .
previous article Stress sensitivity of inductance in NiMgCuZn ferrites and development of a stress insensitive ferrite composition for microinductors
next article Formation and simulation of a thermally stable NiSi FUSI gate electrode by a novel integration process

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

inform now
Literature
1.
2.
3.
J.H. Lau, Flip Chip Technologies. (McGraw-Hill, New York, 1996), pp. 123–153
4.
R. Daveaux, J. Heckman, A. Syed, A. Mawer, Microelectron. Reliab. 40, 1117 (2000)CrossRef
5.
6.
X. Liu, S. Xu, G.Q. Lu, D.A. Dillard, Microelectron. Reliab. 42, 1883 (2002)CrossRef
7.
D.T. Rooney, N.T. Castello, M. Cibulsky, D. Abbott, D. Xie, Microelectron. Reliab. 44, 275 (2004)CrossRef
8.
9.
10.
11.
Y.S. Lai, T.H. Wang, H.H. Tsai, M.H.R. Jen, Microelectron. Reliab. 47, 111 (2007)CrossRef
12.
S.C. Hung, P.J. Zheng, S.H. Ho, S.C. Lee, H.N. Chen, J.D. Wu, Microelectron. Reliab. 41, 677 (2001)CrossRef
13.
J.H. Okura, S. Shetty, B. Ramakrishnan, A. Dasgupta, J.F.J.M. Caers, T. Reinikainen, Microelectron. Reliab. 40, 1173 (2000)CrossRef
14.
K. Mishiro, S. Ishikawa, M. Abe, T. Kumai, Y. Higashiguchi, K.I. Tsubone, Microelectron. Reliab. 42, 77 (2002)CrossRef
Metadata
Title
Effect of underfill on bending fatigue behavior of chip scale package
Authors
Bo-In Noh
Noh-Chang Park
Won-Sik Hong
Seung-Boo Jung
Publication date
01-05-2008
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 5/2008
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-007-9354-x

Other articles of this Issue 5/2008

Journal of Materials Science: Materials in Electronics 5/2008 Go to the issue

OriginalPaper

Structure and dielectric characteristics of epitaxially strained BaTiO3 thin films

OriginalPaper

Two-step annealing of hot wire chemical vapor deposited a-Si:H films

OriginalPaper

Electronic characterization of several 100 μm thick epitaxial GaAs layers

OriginalPaper

Luminescent properties of nanoparticles LaSrAl3O7:RE3+ (RE = Eu, Tb) via the citrate sol–gel method

OriginalPaper

The local structure of bismuth borate glasses doped with europium ions evidenced by FT-IR spectroscopy

OriginalPaper

High tunabilty Ba0.6Sr0.4TiO3 thin films fabricated on Pt–Si substrates with La0.5Sr0.5CoO3 buffer layer