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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 8/2014

01-08-2014

Effects of Ga addition on microstructure and properties of Sn–0.5Ag–0.7Cu solder

Authors: Dong-xue Luo, Song-bai Xue, Zai-qian Li

Published in: Journal of Materials Science: Materials in Electronics | Issue 8/2014

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Abstract

The effects of rare element Ga on solderability, microstructure, and mechanical properties of Sn–0.5Ag–0.7Cu lead-free solder were investigated. The experimental results show that Ga plays a positive role in improving the wettability and the microstructure of the solder. When the content of Ga is at 0.5 wt%, the grain size of the solder is smaller and the shear force is enhanced greatly. It is also found that the thickness of the IMCs at the solder/Cu interface is reduced with proper addition of Ga. The increase of mechanical properties may be related to the refining of IMCs of the solder due to Ga addition.
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Metadata
Title
Effects of Ga addition on microstructure and properties of Sn–0.5Ag–0.7Cu solder
Authors
Dong-xue Luo
Song-bai Xue
Zai-qian Li
Publication date
01-08-2014
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 8/2014
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2057-1

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