Skip to main content
Top
Published in: Journal of Materials Science: Materials in Electronics 13/2019

27-05-2019

Enhanced flexibility and environmental durability of copper electrode produced with conductive ink containing silane coupling agents with diamine and ether spacer

Authors: Shintaro Sakurai, Takuma Uda, Hideya Kawasaki

Published in: Journal of Materials Science: Materials in Electronics | Issue 13/2019

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

Cu-based conductive inks are more cost effective than silver-based ones for flexible electronics. However, it is challenging to simultaneously ensure the mechanical flexibility, environmental oxidation durability, and low resistance of the sintered Cu electrodes. To achieve this goal, Cu-based conductive inks including silane coupling agents are developed and used to produce flexible Cu electrodes on cellulose paper after air–atmosphere sintering. The key factor to achieve the mechanical flexibility and environmental oxidation durability at the same time is the use of aminoethyl-aminopropyltrimethoxysilane (AEAPTMS) or 3-glycidoxypropyltrimethoxysilane (GPTMS). Negligible resistance change is observed in the sintered Cu electrode with AEAPTMS, even after 1000 repeated bending cycles with a bending radius of 5 mm and exposure at 60 °C/80% RH for 7 days. Especially, Cu electrodes produced using GPTMS show improved flexibility with negligible resistance change even after 10,000 bending cycles. To demonstrate the applicability of these Cu electrodes, a flexible paper-based movement sensor is successfully fabricated from the present Cu-based ink. This approach using silane coupling agents will contribute to the reliable operation of Cu-based flexible devices with high mechanical and environmental durability.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Springer Professional "Wirtschaft"

Online-Abonnement

Mit Springer Professional "Wirtschaft" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 340 Zeitschriften

aus folgenden Fachgebieten:

  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Versicherung + Risiko




Jetzt Wissensvorsprung sichern!

Literature
1.
2.
go back to reference Y. Khan, A.E. Ostfeld, C.M. Lochner, A. Pierre, A.C. Arias, Adv. Mater. 28, 4373 (2016)CrossRef Y. Khan, A.E. Ostfeld, C.M. Lochner, A. Pierre, A.C. Arias, Adv. Mater. 28, 4373 (2016)CrossRef
4.
go back to reference S. Choi, S.I. Han, D. Kim, T. Hyeon, D.-H. Kim, Chem. Soc. Rev. 48, 1566 (2019)CrossRef S. Choi, S.I. Han, D. Kim, T. Hyeon, D.-H. Kim, Chem. Soc. Rev. 48, 1566 (2019)CrossRef
5.
go back to reference Z. Ma, S. Li, H. Wang, W. Cheng, Y. Li, L. Pan, Y. Shi, J. Mater. Chem. B 7, 173 (2019)CrossRef Z. Ma, S. Li, H. Wang, W. Cheng, Y. Li, L. Pan, Y. Shi, J. Mater. Chem. B 7, 173 (2019)CrossRef
6.
11.
go back to reference C.Y. Lai, C.F. Cheong, J.S. Mandeep, H.B. Abdullah, N. Amin, K.W. Lai, J. Mater. Eng. Perform. 23, 3541 (2014)CrossRef C.Y. Lai, C.F. Cheong, J.S. Mandeep, H.B. Abdullah, N. Amin, K.W. Lai, J. Mater. Eng. Perform. 23, 3541 (2014)CrossRef
13.
15.
go back to reference K.R. Zope, D. Cormier, S.A. Williams, ACS Appl. Mater. Interfaces 10, 3830 (2018)CrossRef K.R. Zope, D. Cormier, S.A. Williams, ACS Appl. Mater. Interfaces 10, 3830 (2018)CrossRef
16.
go back to reference G. Hassan, J. Bae, C.H. Lee, J. Mater. Sci. 29, 49 (2018) G. Hassan, J. Bae, C.H. Lee, J. Mater. Sci. 29, 49 (2018)
17.
go back to reference W. Yang, C. Wang, V. Arrighi, J. Mater. Sci.: Mater. Electron. 29, 20895 (2018) W. Yang, C. Wang, V. Arrighi, J. Mater. Sci.: Mater. Electron. 29, 20895 (2018)
18.
go back to reference K.S. Siow, S.T. Chua, B.D. Beake, A.S. Zuruzi, J. Mater. Sci.: Mater. Electron. 30, 6212 (2019) K.S. Siow, S.T. Chua, B.D. Beake, A.S. Zuruzi, J. Mater. Sci.: Mater. Electron. 30, 6212 (2019)
19.
go back to reference S.J. Kim, J. Lee, Y.-H. Choi, D.-H. Yeon, Y. Byun, Thin Solid Films 520, 2731 (2012)CrossRef S.J. Kim, J. Lee, Y.-H. Choi, D.-H. Yeon, Y. Byun, Thin Solid Films 520, 2731 (2012)CrossRef
20.
go back to reference S. Jeong, S.H. Lee, Y. Jo, S.S. Lee, Y.-H. Seo, B.W. Ahn, G. Kim, G.-E. Jang, J.-U. Park, B.-H. Ryu, Y. Choi, J. Mater. Chem. C 1, 2704 (2013)CrossRef S. Jeong, S.H. Lee, Y. Jo, S.S. Lee, Y.-H. Seo, B.W. Ahn, G. Kim, G.-E. Jang, J.-U. Park, B.-H. Ryu, Y. Choi, J. Mater. Chem. C 1, 2704 (2013)CrossRef
21.
go back to reference K.-M. Huang, H. Tsukamoto, Y. Yong, H.-L. Chiu, M.T. Nguyen, T. Yonezawa, Y.-C. Liao, RSC Adv. 7, 25095 (2017)CrossRef K.-M. Huang, H. Tsukamoto, Y. Yong, H.-L. Chiu, M.T. Nguyen, T. Yonezawa, Y.-C. Liao, RSC Adv. 7, 25095 (2017)CrossRef
22.
go back to reference Y. Yong, T. Yonezawa, M. Matsubara, H. Tsukamoto, J. Mater. Chem. C 3, 5890 (2015)CrossRef Y. Yong, T. Yonezawa, M. Matsubara, H. Tsukamoto, J. Mater. Chem. C 3, 5890 (2015)CrossRef
23.
go back to reference J. Liu, H. Ji, S. Wang, M. Li, J. Mater. Sci. 27, 13280 (2016) J. Liu, H. Ji, S. Wang, M. Li, J. Mater. Sci. 27, 13280 (2016)
24.
go back to reference W. Li, S. Cong, J. Jiu, S. Nagao, K. Suganuma, J. Mater. Chem. C 4, 8802 (2016)CrossRef W. Li, S. Cong, J. Jiu, S. Nagao, K. Suganuma, J. Mater. Chem. C 4, 8802 (2016)CrossRef
25.
26.
go back to reference Y. Farraj, A. Smooha, A. Kamyshny, S. Magdassi, ACS Appl. Mater. Interfaces 9, 8766 (2017)CrossRef Y. Farraj, A. Smooha, A. Kamyshny, S. Magdassi, ACS Appl. Mater. Interfaces 9, 8766 (2017)CrossRef
27.
go back to reference Y. Yong, M.T. Nguyen, T. Yonezawa, T. Asano, M. Matsubara, H. Tsukamoto, Y.-C. Liao, T. Zhang, S. Isobe, Y. Nakagawa, J. Mater. Chem. C 5, 1033 (2017)CrossRef Y. Yong, M.T. Nguyen, T. Yonezawa, T. Asano, M. Matsubara, H. Tsukamoto, Y.-C. Liao, T. Zhang, S. Isobe, Y. Nakagawa, J. Mater. Chem. C 5, 1033 (2017)CrossRef
28.
go back to reference K.-D. Seong, J.M. Kim, J. Kang, M. Hwang, C. Lee, Y. Piao, Adv. Mater. Inter. 5, 1800502 (2018)CrossRef K.-D. Seong, J.M. Kim, J. Kang, M. Hwang, C. Lee, Y. Piao, Adv. Mater. Inter. 5, 1800502 (2018)CrossRef
29.
go back to reference Y. Zhang, C. Cui, B. Yang, K. Zhang, P. Zhu, G. Li, R. Sun, C. Wong, J. Mater. Sci. 53, 12988 (2018)CrossRef Y. Zhang, C. Cui, B. Yang, K. Zhang, P. Zhu, G. Li, R. Sun, C. Wong, J. Mater. Sci. 53, 12988 (2018)CrossRef
30.
go back to reference C. Paquet, T. Lacelle, X. Liu, B. Deore, A.J. Kell, S. Lafrenière, P.R.L. Malenfant, Nanoscale 10, 6911 (2018)CrossRef C. Paquet, T. Lacelle, X. Liu, B. Deore, A.J. Kell, S. Lafrenière, P.R.L. Malenfant, Nanoscale 10, 6911 (2018)CrossRef
31.
go back to reference W. Li, L. Li, Y. Gao, D. Hu, C.-F. Li, H. Zhang, J. Jiu, S. Nagao, K. Suganuma, J. Alloys Compd. 732, 240 (2018)CrossRef W. Li, L. Li, Y. Gao, D. Hu, C.-F. Li, H. Zhang, J. Jiu, S. Nagao, K. Suganuma, J. Alloys Compd. 732, 240 (2018)CrossRef
32.
go back to reference F. Hermerschmidt, D. Burmeister, G. Ligorio, S.M. Pozov, R. Ward, S.A. Choulis, E.J.W. List-Kratochvil, Adv. Mater. Technol. 3, 1800146 (2018)CrossRef F. Hermerschmidt, D. Burmeister, G. Ligorio, S.M. Pozov, R. Ward, S.A. Choulis, E.J.W. List-Kratochvil, Adv. Mater. Technol. 3, 1800146 (2018)CrossRef
33.
go back to reference T. Qi, Z. Zhang, Y. Li, J. Wang, F. Xiao, J. Mater. Chem. C 6, 11320 (2018)CrossRef T. Qi, Z. Zhang, Y. Li, J. Wang, F. Xiao, J. Mater. Chem. C 6, 11320 (2018)CrossRef
34.
go back to reference Y. Kamikoriyama, H. Imamura, A. Muramatsu, K. Kanie, Sci. Rep. 9, 899 (2019)CrossRef Y. Kamikoriyama, H. Imamura, A. Muramatsu, K. Kanie, Sci. Rep. 9, 899 (2019)CrossRef
35.
36.
go back to reference T. Araki, T. Sugahara, J. Jiu, S. Nagao, M. Nogi, H. Koga, H. Uchida, K. Shinozaki, K. Suganuma, Langmuir 29, 11192 (2013)CrossRef T. Araki, T. Sugahara, J. Jiu, S. Nagao, M. Nogi, H. Koga, H. Uchida, K. Shinozaki, K. Suganuma, Langmuir 29, 11192 (2013)CrossRef
37.
38.
go back to reference S.J. Joo, S.-H. Park, C.-J. Moon, H.-S. Kim, ACS Appl. Mater. Interfaces 7, 5674 (2015)CrossRef S.J. Joo, S.-H. Park, C.-J. Moon, H.-S. Kim, ACS Appl. Mater. Interfaces 7, 5674 (2015)CrossRef
40.
go back to reference W. Li, H. Zhang, Y. Gao, J. Jiu, C.-F. Li, C. Chen, D. Hu, Y. Goya, Y. Wang, H. Koga, S. Nagao, K. Suganuma, J. Mater. Chem. C 5, 1155 (2017)CrossRef W. Li, H. Zhang, Y. Gao, J. Jiu, C.-F. Li, C. Chen, D. Hu, Y. Goya, Y. Wang, H. Koga, S. Nagao, K. Suganuma, J. Mater. Chem. C 5, 1155 (2017)CrossRef
42.
go back to reference Y.-H. Son, J.-Y. Jang, M.K. Kang, S. Ahn, C.S. Lee, Thin Solid Films 656, 61 (2018)CrossRef Y.-H. Son, J.-Y. Jang, M.K. Kang, S. Ahn, C.S. Lee, Thin Solid Films 656, 61 (2018)CrossRef
43.
go back to reference T.G. Kim, H.J. Park, K. Woo, S. Jeong, Y. Choi, S.Y. Lee, ACS Appl. Mater. Interfaces 10, 1059 (2018)CrossRef T.G. Kim, H.J. Park, K. Woo, S. Jeong, Y. Choi, S.Y. Lee, ACS Appl. Mater. Interfaces 10, 1059 (2018)CrossRef
45.
go back to reference M. Kanzaki, Y. Kawaguchi, H. Kawasaki, ACS Appl. Mater. Interfaces 9, 20852 (2017)CrossRef M. Kanzaki, Y. Kawaguchi, H. Kawasaki, ACS Appl. Mater. Interfaces 9, 20852 (2017)CrossRef
46.
go back to reference Y. Dong, Z. Lin, X. Li, Q. Zhu, J.-G. Li, X. Sun, J. Mater. Chem. C 6, 6406 (2018)CrossRef Y. Dong, Z. Lin, X. Li, Q. Zhu, J.-G. Li, X. Sun, J. Mater. Chem. C 6, 6406 (2018)CrossRef
47.
go back to reference S. Shintaro, A. Yusuke, K. Hideya, R. Soc, Open Sci. 5, 172417 (2018) S. Shintaro, A. Yusuke, K. Hideya, R. Soc, Open Sci. 5, 172417 (2018)
48.
49.
go back to reference S. Cho, Z. Yin, Y. Ahn, Y. Piao, J. Yoo, Y.S. Kim, J. Mater. Chem. C 4, 10740 (2016)CrossRef S. Cho, Z. Yin, Y. Ahn, Y. Piao, J. Yoo, Y.S. Kim, J. Mater. Chem. C 4, 10740 (2016)CrossRef
50.
51.
go back to reference M.N. Kirikova, E.V. Agina, A.A. Bessonov, A.S. Sizov, O.V. Borshchev, A.A. Trul, A.M. Muzafarov, S.A. Ponomarenko, J. Mater. Chem. C 4, 2211 (2016)CrossRef M.N. Kirikova, E.V. Agina, A.A. Bessonov, A.S. Sizov, O.V. Borshchev, A.A. Trul, A.M. Muzafarov, S.A. Ponomarenko, J. Mater. Chem. C 4, 2211 (2016)CrossRef
53.
go back to reference Y.-T. Kwon, Y.-S. Kim, Y. Lee, S. Kwon, M. Lim, Y. Song, Y.-H. Choa, W.-H. Yeo, ACS Appl. Mater. Interfaces 10, 44071 (2018)CrossRef Y.-T. Kwon, Y.-S. Kim, Y. Lee, S. Kwon, M. Lim, Y. Song, Y.-H. Choa, W.-H. Yeo, ACS Appl. Mater. Interfaces 10, 44071 (2018)CrossRef
54.
55.
go back to reference W. Li, Y. Yang, B. Zhang, C.-F. Li, J. Jiu, K. Suganuma, Adv. Mater. Interfaces 5, 1800798 (2018)CrossRef W. Li, Y. Yang, B. Zhang, C.-F. Li, J. Jiu, K. Suganuma, Adv. Mater. Interfaces 5, 1800798 (2018)CrossRef
56.
go back to reference M. Abdelmouleh, S. Boufi, A. Ben Salah, M.N. Belgacem, A. Gandini, Langmuir 18, 3203 (2002)CrossRef M. Abdelmouleh, S. Boufi, A. Ben Salah, M.N. Belgacem, A. Gandini, Langmuir 18, 3203 (2002)CrossRef
57.
58.
go back to reference V.A. Zubkov, T.M. Birshtein, I.S. Milevskaya, Polym. Sci. 16, 2830 (1974) V.A. Zubkov, T.M. Birshtein, I.S. Milevskaya, Polym. Sci. 16, 2830 (1974)
59.
go back to reference Y. Zhang, L. Zhang, K. Cui, S. Ge, X. Cheng, M. Yan, J. Yu, H. Liu, Adv. Mater. 30, 1801588 (2018)CrossRef Y. Zhang, L. Zhang, K. Cui, S. Ge, X. Cheng, M. Yan, J. Yu, H. Liu, Adv. Mater. 30, 1801588 (2018)CrossRef
60.
go back to reference Y. Wei, S. Chen, F. Li, Y. Lin, Y. Zhang, L. Liu, ACS Appl. Mater. Interfaces 7, 14182 (2015)CrossRef Y. Wei, S. Chen, F. Li, Y. Lin, Y. Zhang, L. Liu, ACS Appl. Mater. Interfaces 7, 14182 (2015)CrossRef
61.
go back to reference H. Liu, H. Jiang, F. Du, D. Zhang, Z. Li, H. Zhou, ACS Sustain. Chem. Eng. 5, 10538 (2017)CrossRef H. Liu, H. Jiang, F. Du, D. Zhang, Z. Li, H. Zhou, ACS Sustain. Chem. Eng. 5, 10538 (2017)CrossRef
Metadata
Title
Enhanced flexibility and environmental durability of copper electrode produced with conductive ink containing silane coupling agents with diamine and ether spacer
Authors
Shintaro Sakurai
Takuma Uda
Hideya Kawasaki
Publication date
27-05-2019
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 13/2019
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-019-01571-y

Other articles of this Issue 13/2019

Journal of Materials Science: Materials in Electronics 13/2019 Go to the issue