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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 10/2013

01-10-2013 | Erratum

Erratum to: The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures

Authors: Limeng Yin, Song Wei, Zhangliang Xu, Yanfei Geng, Diganta Das, Michael Pecht

Published in: Journal of Materials Science: Materials in Electronics | Issue 10/2013

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Excerpt

Unfortunately, the 5th and 6th coauthors were not listed in the author group of the original publication. The revised author group and their affiliations are listed correctly in this erratum. …
previous article Effect of annealing time in the low-temperature growth of BFO thin films spin coated on glass substrates

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Metadata
Title
Erratum to: The effect of joint size on the creep properties of microscale lead-free solder joints at elevated temperatures
Authors
Limeng Yin
Song Wei
Zhangliang Xu
Yanfei Geng
Diganta Das
Michael Pecht
Publication date
01-10-2013
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 10/2013
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-013-1341-9

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