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International Journal on Interactive Design and Manufacturing (IJIDeM)
Published in: International Journal on Interactive Design and Manufacturing (IJIDeM) 1/2021

22-10-2020 | Short Original Paper

Experimental characterization and modeling of power module warpage during assembly process

Authors: Michele Calabretta, Alessandro Sitta, Salvatore Massimo Oliveri, Gaetano Sequenzia

Published in: International Journal on Interactive Design and Manufacturing (IJIDeM) | Issue 1/2021

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Abstract

Hybrid and full electric automotive market is strongly increasing the demand for power semiconductor modules. With respect to discrete packages, manufacturing of power modules is more complex and new process parameter, such as module deformation (warpage), assumes a key role for a robust design and to guarantee reliable application. The aim of this paper is to study the warpage behaviour during power module assembly flow by means of dedicated warpage measurement at different process steps. Once highlighted the most impacting process for warpage, a finite element model has been developed to reproduce phenomenology, predicting the induced deformation.
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Literature
1.
Calabretta, M., Sitta, A., Oliveri, S. M., & Sequenzia, G.: Design and process optimization of a sintered joint for power electronics automotive applications. In: International Conference on Design, Simulation, Manufacturing: The Innovation Exchange (pp. 470–480). Springer, Cham (2019)
2.
Mirone, G., Sitta, A., D’Arrigo, G., Calabretta, M.: Material characterization and warpage modeling for power devices active metal brazed substrates. IEEE Trans. Device Mater. Reliab. 19(3), 537–542 (2019)CrossRef
3.
Nishimura, Y., Kido, K., Momose, F., Goto, T.: Development of ultrasonic welding for IGBT module structure. In: 2010 22nd International Symposium on Power Semiconductor Devices & IC’s (ISPSD) (pp. 293–296). IEEE (2010)
4.
Qian, R., Yao, A., Xu, B., Liu, Y., Chew, C.H.: High power module package mounting and temperature cycling reliability study by simulation. In 2018 19th International Conference on Electronic Packaging Technology (ICEPT) (pp. 1578-1574). IEEE (2018)
Metadata
Title
Experimental characterization and modeling of power module warpage during assembly process
Authors
Michele Calabretta
Alessandro Sitta
Salvatore Massimo Oliveri
Gaetano Sequenzia
Publication date
22-10-2020
Publisher
Springer Paris
Published in
International Journal on Interactive Design and Manufacturing (IJIDeM) / Issue 1/2021
Print ISSN: 1955-2513
Electronic ISSN: 1955-2505
DOI
https://doi.org/10.1007/s12008-020-00735-z

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