Issue 2/2004
Content (12 Articles)
Non-destructive evaluation of the interface between silicon dies and copper leadframes in integrated circuit packaging
J. Abdul, N. Guo, H. Du, B. S. Wong, K. C. Chan
Design and evaluation of the poleidoscope: A novel digital polariscope
J. Lesniak, S. J. Zhang, E. A. Patterson
Failure loads of spot weld specimens under impact opening and shear loading conditions
S. -H. Lin, J. Pan, S. Wu, T. Tyan
Laser surface-contouring and spline data-smoothing for residual stress measurement
M. B. Prime, R. J. Sebring, J. M. Edwards, D. J. Hughes, P. J. Webster
Analytical/experimental investigation of energy absorption in grid-stiffened composite structures under transverse loading
C. Gan, R. F. Gibson, G. M. Newaz
An experimental—Numerical evaluation of theT ε * integral for a three-dimensional crack front
J. H. Jackson, A. S. Kobayashi, S. N. Atluri
Thermomechanical behavior of underfill/solder mask/substrate interface under thermal cycling
C. -H. Chien, Y. -C. Chen, C. -C. Hsieh, Y. -T. Chiou, Y. -D. Wu, T. -P. Chen