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Published in: Microsystem Technologies 8-9/2010

01-08-2010 | Technical Paper

Fabrication of micro-capacitive inclination sensor by resin molding

Authors: Hiroaki Miyake, Kazufumi Nishimoto, Satoshi Nishida, Daiji Noda, Tadashi Hattori

Published in: Microsystem Technologies | Issue 8-9/2010

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Abstract

Capacitive inclination sensors have the advantage that they can easily provide a linear analog output with respect to inclination. Although inclination sensors featuring this advantages are already commercially available, they are generally too large. We fabricated a micro-capacitive inclination sensor by a combination of a resin forming method and a mold. Electrodes of the sensor are 40 μm in a gap and 12 mm2 in area. The sensor detects difference of capacitance, which varies with movement of silicone oil accompanying with inclination of the sensor. Since the dimensions of the sensing region are 5 × 5 × 3 mm3 this inclination sensor is expected to be widely used in fields where efficient and reliable position control is a primary factor to be considered. The use of resins is also expected to contribute to a reduction in the costs of materials. We successfully fabricated a micro inclination sensor as a molded product. In future, we will wire up the device to complete this inclination sensor, and will then conduct performance evaluations. If techniques using resin-molded parts are introduced to the low-cost mass-production of Micro Electro Mechanical Systems devices, the range of applications will further expand to new areas of technology and industry.

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Literature
go back to reference Beker EW, Ehrfeld W, Maner A, Munchmeyer D (1986) Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming and plastics molding. Microelectron Eng 4:35–42CrossRef Beker EW, Ehrfeld W, Maner A, Munchmeyer D (1986) Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming and plastics molding. Microelectron Eng 4:35–42CrossRef
go back to reference Idei K, Mekaru H, Takeda H, Hattori T (2006) Precise micro pattern replication by hot embossing. JSME Int J 49(1):69–73CrossRef Idei K, Mekaru H, Takeda H, Hattori T (2006) Precise micro pattern replication by hot embossing. JSME Int J 49(1):69–73CrossRef
go back to reference Ishizawa N, Idei K, Kimura T, Noda D, Hattori T (2007) Resin micromachining by roller hot embossing. Abstracts of the international workshop on high-aspect-ratio micro-structure technology, Besancon, France, pp 157–158 Ishizawa N, Idei K, Kimura T, Noda D, Hattori T (2007) Resin micromachining by roller hot embossing. Abstracts of the international workshop on high-aspect-ratio micro-structure technology, Besancon, France, pp 157–158
go back to reference Kohsaka F, Liang J, Matsuo T, Ueda T (2007) High sensitive tilt sensor for quarts micromachining. IEEJ Trans SM 127(10):431–436CrossRef Kohsaka F, Liang J, Matsuo T, Ueda T (2007) High sensitive tilt sensor for quarts micromachining. IEEJ Trans SM 127(10):431–436CrossRef
go back to reference Nishimoto K, Ishizawa N, Ueda H, Noda D, Hattori T (2008) Surface modification and direct bonding of different materials irradiated H2O ion. J Adv Mech Des Syst Manufact 2(2):197–202CrossRef Nishimoto K, Ishizawa N, Ueda H, Noda D, Hattori T (2008) Surface modification and direct bonding of different materials irradiated H2O ion. J Adv Mech Des Syst Manufact 2(2):197–202CrossRef
go back to reference Ueda H, Ueno H, Itoigawa K, Hattori T (2006) Electrostatic capacity type micro inclination sensor utilizing dielectric nano-particles. Proceedings of the international symposium on micro-nanomechatronics and human science, Nagoya, Japan, pp 545–550 Ueda H, Ueno H, Itoigawa K, Hattori T (2006) Electrostatic capacity type micro inclination sensor utilizing dielectric nano-particles. Proceedings of the international symposium on micro-nanomechatronics and human science, Nagoya, Japan, pp 545–550
go back to reference Ueda H, Ueno H, Itoigawa K, Hattori T (2006) Micro capacitive inclination sensor utilizing dielectric nano-particles. Proceedings of the MEMS 2006, Istanbul, Turkey, pp 706–709 Ueda H, Ueno H, Itoigawa K, Hattori T (2006) Micro capacitive inclination sensor utilizing dielectric nano-particles. Proceedings of the MEMS 2006, Istanbul, Turkey, pp 706–709
Metadata
Title
Fabrication of micro-capacitive inclination sensor by resin molding
Authors
Hiroaki Miyake
Kazufumi Nishimoto
Satoshi Nishida
Daiji Noda
Tadashi Hattori
Publication date
01-08-2010
Publisher
Springer-Verlag
Published in
Microsystem Technologies / Issue 8-9/2010
Print ISSN: 0946-7076
Electronic ISSN: 1432-1858
DOI
https://doi.org/10.1007/s00542-010-1060-6

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