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Deformation and Fatigue of Solders Read chapter Read first chapter

2011 | OriginalPaper | Chapter

2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints

Author : K. Lambrinou

Published in: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Publisher: Springer London

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Abstract

This chapter mainly addresses the factors affecting the bulk embrittlement of Sn-based Pb-free solder joints, as this type of embrittlement may occur during the life cycle of these solder joints, depending on the requirements of their ‘mission profile’. The term ‘bulk embrittlement’ is used to describe brittle failures occurring in the solder bulk, in contrast to the brittle failures that occur in the intermetallic layers at the solder joint/bond pad interface. The factors affecting the bulk embrittlement of Sn-based Pb-free solder joints may be divided into ‘intrinsic’ and ‘extrinsic’. Examples of ‘intrinsic’ factors include the solder composition, crystal structure, and microstructure, while examples of ‘extrinsic’ factors include the temperature, strain rate, and constraint of the solder during service, as well as the cooling rate from the processing temperature. By understanding the mechanism of bulk solder embrittlement and the factors affecting it, one may try to find the ways to control it, especially when the conditions of the end application favour such type of embrittlement.

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previous chapter Deformation and Fatigue of Solders
next chapter Thermal Fatigue Analysis
Literature
1.
Barsom JM, Rolfe ST (1999) Fracture and fatigue control in structures: applications of fracture mechanics, 3rd edn. ASTM Man Ser: MNL41, ASTM Int, West Conshohocken, USACrossRef
2.
Hertzberg RW (1996) Deformation and fracture mechanics of engineering materials, 4th edn. Wiley, New York, USA
3.
Hosford WF (2005) Mechanical behavior of materials, 1st edn. Cambridge University Press, New York, USACrossRef
4.
Hurlich A (1968) Low temperature metals. In: Prodell AG (ed) Proc 1968 summer study supercond devices accel, pp 311–325
5.
Callister WD Jr (2000) Materials science and engineering: an introduction, 5th edn. Wiley, New York, USA
6.
Reed-Hill RE, Abbaschian R (1994) Physical metallurgy principles, 3rd edn. PWS Publishing Company, Boston, USA
7.
Askeland DR, Phulé PP (2006) The science and engineering of materials, 5th edn. Nelson, Toronto, Canada
8.
9.
Askeland DR (1984) The science and engineering of materials, 1st edn. Brooks/Cole, Monterey, USA
10.
ASTM E 23-06 (2006) Standard test methods for notched bar impact testing of metallic materials. ASTM Int
11.
Ratchev P, Loccufier T, Vandevelde B, Verlinden B, Teliszewski S, Werkhoven D, Allaert B (2005) A study of brittle to ductile fracture transition temperatures in bulk Pb-free solders. Proc EMPC 2005:248–252
12.
Ratchev P, Vandevelde B, Verlinden B, Allaert B, Werkhoven D (2007) Brittle to ductile fracture transition in bulk Pb-free solders. IEEE Trans Compon Packag Technol 30:416–423CrossRef
13.
Kariya Y, Gagg C, Plumbridge WJ (2000) Tin pest in lead-free solders. Solder Surf Mount Technol 13:39–40CrossRef
14.
Metallography and Microstructures of Tin and Tin Alloys (2004) In: ASM Handb, vol 9: Metallography and Microstructures. ASM Int
15.
Limaye P, Maurissen W, Lambrinou K, Duflos F, Vandevelde B, Allaert B, Hillaert J, Vandepitte D, Verlinden B (2007) Low-temperature embrittlement of lead-free solders in joint level impact testing. Proc EPTC 2007:140–151
16.
Lambrinou K, Maurissen W, Limaye P, Vandevelde B, Verlinden B, De Wolf I (2009) A novel mechanism of embrittlement affecting the impact reliability of tin-based lead-free solder joints. J Electron Mater 38:1881–1895CrossRef
17.
Ratchev P, Vandevelde B, Verlinden B (2005) Effect of the intermetallics particle size on the brittle to ductile fracture transition in a bulk Sn-4 wt%Ag-0.5 wt%Cu solder. CD-ROM Proc IPC/JEDEC 10th Int Conf Lead-Free Electron Compon Assem
18.
Ganesan S, Pecht M (eds) (2006) Lead-free electronics. IEEE Press, Wiley, Hoboken, USA
Metadata
Title
Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints
Author
K. Lambrinou
Copyright Year
2011
Publisher
Springer London
Book
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Print ISBN: 978-0-85729-235-3

Electronic ISBN: 978-0-85729-236-0

Copyright Year: 2011

DOI
https://doi.org/10.1007/978-0-85729-236-0_2