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Published in:
Deformation and Fatigue of Solders Read chapter Read first chapter

2011 | OriginalPaper | Chapter

3. Thermal Fatigue Analysis

Authors : Rainer Dudek, Ellen Auerswald

Published in: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Publisher: Springer London

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Abstract

Solder low-cycle fatigue damage caused by temperature changes is one major reliability concern in electronics. In the paper, two fundamental approaches to characterize the solder joint fatigue resistance are introduced: testing and theoretical modelling. Thermal test cycling, which is applied to the majority of electronic products, is discussed in more detail and reference to different standards is made. Additionally, theoretical modelling based on analytical estimates as well as on numerical models, i.e. finite element models, is briefly introduced.

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previous chapter Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints
next chapter Electrochemical Behaviour of Solder Alloys
Literature
1.
Bieler TR, Jiang H, Lehman LP, Kirkpatrick T, Cotts EJ (2006) Influence of Sn grain size and orientation on the thermomechanical response and reliability of Pb-free solder joints. In: Proceedings, 56th electronic components & technology conference, San Diego, pp 1462–1469
2.
Gong J, Liu Ch, Conway PP, Silberschmidt VV (2006) Grain features of SnAgCu solder and their effect on mechanical behavior of micro-joints. In: Proceedings of 56th electronic components & technology conference, San Diego, pp 250–257
3.
Dunford S, Canumalla S, Viswanadham P (2004) Intermetallic morphology and damage evolution under thermomechanical fatigue of Pb-free solder interconnections. In: Proceedings of 54th ECTC, Las Vegas, pp 726–735
4.
Grossmann G, Jud PP, Sennhauser U (2005) Microstructure and deformation behavior of SnAg3.8Cu0.7 lead-free solder. In: The world of electronic packaging and system integration. Fraunhofer Institute Reliability and Microintegration, Berlin
5.
Dudek R, Faust W, Gollhardt A, Michel B (2006) A FE study of solder fatigue compared to microstructural damage evaluation by in situ laser scanning and FIB microscopy. In: Proceedings ITherm 2006, San Diego, USA
6.
Dušek M, Nottay J, Hunt C (2001) Compatibility of lead-free solders with PCB materials. National Physical Laboratory, UK, NPL Report MATC (A) 89
7.
Clech J-P (2004) Lead-free and mixed assembly solder joint reliability trends. IPC Printed Circuits Expo®, SMEMA Council APEX, Designers Summit 04
8.
Andersson et al (2004) Effect of different temperature cycle profiles on the crack propagation and microstructural evolution of lead free solder joints of different electronic components. In: Proceedings of Eurosime, Brussels
9.
Schubert A, Dudek R, Auerswald E, Gollhardt A, Michel B, Reichl H (2003) Fatigue life models for SnAgCu and SnPb solder joints evaluated by experiments and simulation. In: Proceedings of 53rd electronic components & technology conference, pp 603–610
10.
Drozd Z (2006) Testing methodology and results from thermal shock tests in the project GreenRoSE. ELFNET Project meeting, Athens
11.
Vandevelde B, Ratchev P, Limaye P (2006) Latest results from ALSHIRA. ELFNET Project meeting, Athens
12.
Dušek M (2006) NPL—lead-free projects of electronics interconnection group. ELFNET Project meeting, Dubendorf
13.
Vandevelde B, Gonzalez M, Limaye P, Labie R, Ratchev P, Vanfleteren J, Beyne E (2004) Leadfree solder joint reliability estimation by finite element modelling: advantages, challenges and limitations. In: IPC-/JEDEC 7th international conference on leadfree electronic components and assemblies, Frankfurt
14.
Dudek R (2006) Characterization and modelling of solder joint reliability. In: Zhang GQ, van Driel WD, Fan XJ (eds) Mechanics of microelectronics. Springer Science+Business Media, Dordrecht, pp 377–466CrossRef
15.
Lau J, Dauksher W, Vianco P (2003) Acceleration models, constitutive equations, and reliability of lead-free solders and joints. In: Proceedings, 53rd electronic components & technology conference, pp 229–236
16.
Zhang Q, Dasgupta A, Haswell P (2003) Viscoplastic constitutive properties and energy-partitioning model of lead-free Sn3.9Ag0.6Cu solder alloy. In: Proceedings of 53rd electronic components & technology conference, pp 1862–1868
17.
Clech JP, Handwerker C (2002) Review and analysis of lead-free solder material properties BGA, Flip-Chip. ESPI Inc., NIST
18.
Pang JHL, Xiong BS, Neo CC, Zhang XR, Low TH (2003) Bulk solder and solder joint properties for lead free SnAgCu solder alloy. In: Proceedings of 53rd electronic components & technology conference, pp 673–679
19.
Wiese S, Meusel E, Wolter K-J (2003) Microstructural dependence of constitutive properties of eutectic SnAg and SnAgCu solders. In: Proceedings of 53rd electronic components & technology conference, pp 197–206
20.
Wiese S, Roellig M, Mueller M, Rzepka S, Nocke K, Luhmann C, Kraemer F, Meier K, Wolter K-J (2006) The influence of size and composition on the creep of SnAgCu solder joints. In: Proceedings ESTC, Dresden, Germany, pp 912–926
21.
Norris KC, Landzberg AH (1969) Reliability of controlled collapse interconnections. IBM J Res Dev, pp 266–271
22.
Pan N, Henshall GA, Billaut F, Dai S, Strum MJ, Benedetto E, Rayner J (2005) An acceleration model for Sn-Ag-Cu solder joint reliability under various thermal cycle conditions. In: Proceedings of SMTA international conference, Chicago
23.
Hillman C (2006) Assessment of Pb-Free Norris-Landzberg model to JG-PP test data. Presentation DfR Solutions
Metadata
Title
Thermal Fatigue Analysis
Authors
Rainer Dudek
Ellen Auerswald
Copyright Year
2011
Publisher
Springer London
Book
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Print ISBN: 978-0-85729-235-3

Electronic ISBN: 978-0-85729-236-0

Copyright Year: 2011

DOI
https://doi.org/10.1007/978-0-85729-236-0_3