Skip to main content
Top
Published in: Journal of Electronic Materials 3/2021

03-01-2021 | Original Research Article

Ferroelectric BT–PVDF Composite Thick Films for Electrical Energy Storage

Authors: Hicham Ait Laasri, Didier Fasquelle, Amina Tachafine, Jean-Claude Carru, Mohamed Rguiti, Mohamed Elaatmani

Published in: Journal of Electronic Materials | Issue 3/2021

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …

Abstract

Hybrid composites have been elaborated by incorporation of BaTiO3 (BT) inorganic nanoparticles into polyvinylidene fluoride (PVDF) polymer. BT–PVDF composite thick films with different volume fractions of BT (0%, 7%, 15%, and 30%) were deposited by spin-coating onto Pt/SiO2/Si substrates. The effects of the BT inorganic content in the PVDF polymeric matrix on the structural, dielectric, ferroelectric, and energy storage properties were investigated at room temperature. The crystal structure of the samples was identified by X-ray diffraction analysis, and their morphology was observed by scanning electron microscopy. Introduction of BT nanoparticles into the PVDF polymer led to a remarkable enhancement of the dielectric constant value and ferroelectric polarization. Additionally, the abnormal dielectric behavior observed for the composite with 30 vol.% BT nanoparticle volume fraction can be explained by the existence of a Debye relaxation domain at low frequency. Moreover, the stored energy density Wc was enhanced from 2.4 J/cm3 for pure PVDF polymer to 9 J/cm3 for the 30 vol.% BT nanoparticle volume fraction. Such BT–PVDF composite thick films are thus promising materials for the manufacture of electrostatic capacitors for electrical energy storage.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

Literature
2.
go back to reference VGB Facts and Figures—Electricity Generation 2018/2019. VGB Facts and Figures—Electricity Generation 2018/2019.
3.
go back to reference H. Chen, T.N. Cong, W. Yang, C. Tan, Y. Li, and Y. Ding, Prog. Nat. Sci. 19, 291 (2009).CrossRef H. Chen, T.N. Cong, W. Yang, C. Tan, Y. Li, and Y. Ding, Prog. Nat. Sci. 19, 291 (2009).CrossRef
4.
5.
7.
go back to reference B. Chu, X. Zhou, K. Ren, B. Neese, M. Lin, Q. Wang, F. Bauer, and Q.M. Zhang, Science 313, 334 (2006).CrossRef B. Chu, X. Zhou, K. Ren, B. Neese, M. Lin, Q. Wang, F. Bauer, and Q.M. Zhang, Science 313, 334 (2006).CrossRef
8.
go back to reference X. Zhou, B. Chu, B. Neese, M. Lin, and Q.M. Zhang, Dielectr. Electr. Insul. IEEE Trans. 14, 1133 (2007).CrossRef X. Zhou, B. Chu, B. Neese, M. Lin, and Q.M. Zhang, Dielectr. Electr. Insul. IEEE Trans. 14, 1133 (2007).CrossRef
9.
go back to reference L. Xie, X. Huang, Y. Huang, K. Yang, and P. Jiang, ACS Appl. Mater. Interfaces 5, 1747 (2013).CrossRef L. Xie, X. Huang, Y. Huang, K. Yang, and P. Jiang, ACS Appl. Mater. Interfaces 5, 1747 (2013).CrossRef
10.
go back to reference S. Satapathy, S. Pawar, P.K. Gupta, and K.B.R. Varma, Bull. Mater. Sci. 34, 727 (2011).CrossRef S. Satapathy, S. Pawar, P.K. Gupta, and K.B.R. Varma, Bull. Mater. Sci. 34, 727 (2011).CrossRef
11.
go back to reference G. Hu, F. Gao, J. Kong, S. Yang, Q. Zhang, Z. Liu, Y. Zhang, and H. Sun, J. Alloys Compd. 619, 686 (2015).CrossRef G. Hu, F. Gao, J. Kong, S. Yang, Q. Zhang, Z. Liu, Y. Zhang, and H. Sun, J. Alloys Compd. 619, 686 (2015).CrossRef
12.
go back to reference J. Ma, U. Azhar, C. Zong, Y. Zhang, A. Xu, C. Zhai, L. Zhang, and S. Zhang, Mater. Des. 164, 107556 (2019).CrossRef J. Ma, U. Azhar, C. Zong, Y. Zhang, A. Xu, C. Zhai, L. Zhang, and S. Zhang, Mater. Des. 164, 107556 (2019).CrossRef
13.
go back to reference C. Chen, L. Wang, X. Liu, W. Yang, J. Lin, G. Chen, and X. Yang, Polymers 11, 310 (2019).CrossRef C. Chen, L. Wang, X. Liu, W. Yang, J. Lin, G. Chen, and X. Yang, Polymers 11, 310 (2019).CrossRef
14.
go back to reference A.M. Pourrahimi, R.T. Olsson, and M.S. Hedenqvist, Adv. Mater. 30, 1703624 (2018).CrossRef A.M. Pourrahimi, R.T. Olsson, and M.S. Hedenqvist, Adv. Mater. 30, 1703624 (2018).CrossRef
15.
go back to reference K. Yu, H. Wang, Y. Zhou, Y. Bai, and Y. Niu, J. Appl. Phys. 113, 034105 (2013).CrossRef K. Yu, H. Wang, Y. Zhou, Y. Bai, and Y. Niu, J. Appl. Phys. 113, 034105 (2013).CrossRef
16.
go back to reference Y. Niu, K. Yu, Y. Bai, and H. Wang, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 62, 108 (2015).CrossRef Y. Niu, K. Yu, Y. Bai, and H. Wang, IEEE Trans. Ultrason. Ferroelectr. Freq. Control 62, 108 (2015).CrossRef
17.
go back to reference H.-J. Ye, W.Z. Shaoa, and L. Zhen, Colloids Surf. A Physicochem. Eng. Asp. 427, 19 (2013).CrossRef H.-J. Ye, W.Z. Shaoa, and L. Zhen, Colloids Surf. A Physicochem. Eng. Asp. 427, 19 (2013).CrossRef
18.
go back to reference T. Zhou, J.W. Zha, R.Y. Cui, B.H. Fan, J.K. Yuan, and Z.M. Dang, ACS Appl. Mater. Interfaces. 3, 2184 (2011).CrossRef T. Zhou, J.W. Zha, R.Y. Cui, B.H. Fan, J.K. Yuan, and Z.M. Dang, ACS Appl. Mater. Interfaces. 3, 2184 (2011).CrossRef
19.
go back to reference L. Gao, J. He, J. Hu, and Y. Li, J. Phys. Chem. 118, 831 (2014). L. Gao, J. He, J. Hu, and Y. Li, J. Phys. Chem. 118, 831 (2014).
20.
go back to reference J. Fu, Y. Hou, M. Zheng, Q. Wei, M. Zhu, and H. Yan, ACS Appl. Mater. Interfaces. 7, 24480 (2015).CrossRef J. Fu, Y. Hou, M. Zheng, Q. Wei, M. Zhu, and H. Yan, ACS Appl. Mater. Interfaces. 7, 24480 (2015).CrossRef
21.
22.
go back to reference B. Chu, X. Zhou, B. Neese, and Q.M. Zhang, IEEE Trans. Dielectr. Electr. Insul. 13, 1162 (2006).CrossRef B. Chu, X. Zhou, B. Neese, and Q.M. Zhang, IEEE Trans. Dielectr. Electr. Insul. 13, 1162 (2006).CrossRef
23.
24.
go back to reference W. Li, Q. Meng, Y. Zheng, Z. Zhang, W. Xia, and Z. Xu, Appl. Phys. Lett. 96, 192905 (2010).CrossRef W. Li, Q. Meng, Y. Zheng, Z. Zhang, W. Xia, and Z. Xu, Appl. Phys. Lett. 96, 192905 (2010).CrossRef
25.
26.
go back to reference S.P.P. Sadhu, S. Siddabattuni, S.V. Muthukumar, and K.B.R. Varma, J. Mater. Sci.: Mater. Electron. 29, 6174 (2018). S.P.P. Sadhu, S. Siddabattuni, S.V. Muthukumar, and K.B.R. Varma, J. Mater. Sci.: Mater. Electron. 29, 6174 (2018).
27.
go back to reference Z. Cai, X. Wang, B. Luo, W. Hong, L. Wu, and L. Li, Compos. Sci. Technol. 145, 105 (2017).CrossRef Z. Cai, X. Wang, B. Luo, W. Hong, L. Wu, and L. Li, Compos. Sci. Technol. 145, 105 (2017).CrossRef
Metadata
Title
Ferroelectric BT–PVDF Composite Thick Films for Electrical Energy Storage
Authors
Hicham Ait Laasri
Didier Fasquelle
Amina Tachafine
Jean-Claude Carru
Mohamed Rguiti
Mohamed Elaatmani
Publication date
03-01-2021
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 3/2021
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-020-08657-y

Other articles of this Issue 3/2021

Journal of Electronic Materials 3/2021 Go to the issue

TMS2020 Microelectronic Packaging, Interconnect, and Pb-free Solder

Whisker Growth in Sn Coatings: A Review of Current Status and Future Prospects