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Journal of Electronic Materials
Published in: Journal of Electronic Materials 12/2009

01-12-2009

Foreword

Authors: Sung K. Kang, Iver Anderson, Srini Chada, Jeng-Gong Duh, Laura J. Turbini, Albert Wu, C. Robert Kao, Fay Hua, K. N. Subramanian, Darrel Frear, Carol Handwerker, Fu Guo, Nik Chawla, Kejun Zeng

Published in: Journal of Electronic Materials | Issue 12/2009

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next article Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy

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Metadata
Title
Foreword
Authors
Sung K. Kang
Iver Anderson
Srini Chada
Jeng-Gong Duh
Laura J. Turbini
Albert Wu
C. Robert Kao
Fay Hua
K. N. Subramanian
Darrel Frear
Carol Handwerker
Fu Guo
Nik Chawla
Kejun Zeng
Publication date
01-12-2009
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 12/2009
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-009-0939-4

Other articles of this Issue 12/2009

Journal of Electronic Materials 12/2009 Go to the issue

OriginalPaper

Inhomogeneous Consumption of the Electroless Ni-P Layer at the Solder Joint Formed with Sn-3.5Ag-0.7Cu

OriginalPaper

Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders

OriginalPaper

Mechanical Shock Behavior of Bulk Pure Sn Solder

OriginalPaper

Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration

OriginalPaper

Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound

OriginalPaper

Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints