Ausgabe 12/2009
Special Issue: 2009 Pb-Free Solders
Inhalt (43 Artikel)
Foreword
Sung K. Kang, Iver Anderson, Srini Chada, Jeng-Gong Duh, Laura J. Turbini, Albert Wu, C. Robert Kao, Fay Hua, K. N. Subramanian, Darrel Frear, Carol Handwerker, Fu Guo, Nik Chawla, Kejun Zeng
Heterogeneous Intragranular Inelastic Behavior of a Sn-Ag-Cu Alloy
Jicheng Gong, Paul P. Conway, Changqing Liu, Vadim V. Silberschmidt
Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate
Jagjiwan Mittal, Shih-Ming Kuo, Yu-Wei Lin, Kwang-Lung Lin
Nonuniform and Negative Marker Displacements Induced by Current Crowding During Electromigration in Flip-Chip Sn-0.7Cu Solder Joints
S. W. Liang, Hsiang-Yao Hsiao, Chih Chen, Luhua Xu, K. N. Tu, Yi-Shao Lai
Effect of Wet Pretreatment on Interfacial Adhesion Energy of Cu-Cu Thermocompression Bond for 3D IC Packages
Eun-Jung Jang, Seungmin Hyun, Hak-Joo Lee, Young-Bae Park
Interfacial Adhesion Characteristics Between Electroless-Plated Ni and Polyimide Films Modified by Alkali Surface Pretreatment
Kyoung-Jin Min, Sung-Cheol Park, Kyu Hwan Lee, Yongsoo Jeong, Young-Bae Park
The Crystal Orientation of β-Sn Grains in Sn-Ag and Sn-Cu Solders Affected by Their Interfacial Reactions with Cu and Ni(P) Under Bump Metallurgy
Sun-Kyoung Seo, Sung K. Kang, Moon Gi Cho, Da-Yuan Shih, Hyuck Mo Lee
Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces
H.Y. Guo, J.D. Guo, J.K. Shang
Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates
M. E. Alam, S. M. L. Nai, M. Gupta
Mechanical Property Evaluation of Sn-3.0A-0.5Cu BGA Solder Joints Using High-Speed Ball Shear Test
Sang-Su Ha, Jin-Kyu Jang, Sang-Ok Ha, Jong-Woong Kim, Jeong-Won Yoon, Byung-Woo Kim, Sun-Kyu Park, Seung-Boo Jung
Characterization of the Effect of Shape Memory Alloy on Solder Joint Strength Through Modeling and Testing
Chia-Yen Tan, Jenq-Gong Duh
Interfacial Reactions Between In-Sn Solder and Ni-Fe Platings
John P. Daghfal, P. J. Shang, Z. Q. Liu, J. K. Shang
Mitigation of Sn Whisker Growth by Composite Ni/Sn Plating
Aleksandra Dimitrovska, Radovan Kovacevic
Multiphase Field Simulations of Intermetallic Compound Growth During Lead-Free Soldering
M. S. Park, R. Arróyave
Shear and Pull Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Underbump Metallization During Aging
Kai-Jheng Wang, Jenq-Gong Duh
Inhomogeneous Consumption of the Electroless Ni-P Layer at the Solder Joint Formed with Sn-3.5Ag-0.7Cu
Yong-Jun Oh, Sung-Yong Oh
The Influence of Current Direction on the Cu-Ni Cross-Interaction in Cu/Sn/Ni Diffusion Couples
W.H. Wu, H.L. Chung, C.N. Chen, C.E. Ho
Electromigration-Induced Failure of Ni/Cu Bilayer Bond Pads Joined with Sn(Cu) Solders
Y. H. Hsiao, H. W. Tseng, C. Y. Liu
TEM Observations of the Growth of Intermetallic Compounds at the SnBi/Cu Interface
P. J. Shang, Z. Q. Liu, D. X. Li, J. K. Shang
The Interaction Between an Imposed Current and the Creep of Idealized Sn-Ag-Cu Solder Interconnects
Christopher Kinney, Tae-Kyu Lee, Kuo-Chuan Liu, J. W. Morris
ENIG Corrosion Induced by Second-Phase Precipitation
John Osenbach, Ahmed Amin, Frank Baiocchi, John DeLucca
Microstructure, Intermetallic Growth, and Reliability of Rapidly Solidified Pb-Free Solder Joints Formed via Solder Ball Jetting
John L. Wagner, Peter F. Ladwig, Doug P. Riemer, Galen Houk
Estimation Method for Liquidus Temperature of Lead-Free Solder Using Differential Scanning Calorimetry Profiles
Hiroshi Nishikawa, Yoshihito Hamada, Tadashi Takemoto
Correlations Between the Microstructure and Fatigue Life of Near-Eutectic Sn-Ag-Cu Pb-Free Solders
Babak Arfaei, Eric Cotts
Microstructure and Reliability Comparison of Different Pb-Free Alloys Used for Wave Soldering and Rework
Polina Snugovsky, Zohreh Bagheri, Craig Hamilton
Effect of Electromigration and Isothermal Aging on the Formation of Metal Whiskers and Hillocks in Eutectic Sn-Bi Solder Joints and Reaction Films
Fu Guo, Guangchen Xu, Hongwen He, Mengke Zhao, Jia Sun, C. Henry Wang
Impact Behavior of Thermomechanically Fatigued Sn-Based Solder Joints
Takayuki Kobayashi, Andre Lee, K. N. Subramanian
Improving the Reliability of Si Die Attachment with Zn-Sn-Based High-Temperature Pb-Free Solder Using a TiN Diffusion Barrier
Seongjun Kim, Keun-Soo Kim, Sun-Sik Kim, Katsuaki Suganuma, Goro Izuta
Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound
Eric Buchovecky, Nitin Jadhav, Allan F. Bower, Eric Chason
Microstructure and Orientation Evolution of the Sn Phase as a Function of Position in Ball Grid Arrays in Sn-Ag-Cu Solder Joints
Tae-Kyu Lee, Kuo-Chuan Liu, Thomas R. Bieler
Analysis of Slip Behavior in a Single Shear Lap Lead-Free Solder Joint During Simple Shear at 25°C and 0.1/s
Thomas R. Bieler, Adwait U. Telang
Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear
Bite Zhou, Thomas R. Bieler, Tae-Kyu Lee, Kuo-Chuan Liu
Methodology for Analyzing Strain States During In Situ Thermomechanical Cycling in Individual Lead-Free Solder Joints Using Synchrotron Radiation
Thomas R. Bieler, Tae-kyu Lee, Kuo-Chuan Liu
Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology
Teymur Bakhishev, Vivek Subramanian
The Effect of Micro-Alloying of Sn Plating on Mitigation of Sn Whisker Growth
Aleksandra Dimitrovska, Radovan Kovacevic
Liquid Phase Sintered Solders with Indium as Minority Phase for Next Generation Thermal Interface Material Applications
I. Dutta, R. Raj, P. Kumar, T. Chen, C. M. Nagaraj, J. Liu, M. Renavikar, V. Wakharkar
Mechanical Shock Behavior of Bulk Pure Sn Solder
K. E. Yazzie, H. Fei, J. J. Williams, H. Jiang, N. Chawla
Resistance Changes in Eutectic Sn-Bi Solder Joints During Electromigration
Fu Guo, Guangchen Xu, Jia Sun, Zhidong Xia, Yongping Lei, Yaowu Shi, Xiaoyan Li
Evaluations of Whisker Growth and Fatigue Reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce Solder Ball Grid Array Packages
Tung-Han Chuang, Chih-Yuan Cheng, Tao-Chih Chang
Nucleation Control and Thermal Aging Resistance of Near-Eutectic Sn-Ag-Cu-X Solder Joints by Alloy Design
Iver E. Anderson, Jason W. Walleser, Joel L. Harringa, Fran Laabs, Alfred Kracher
Erratum to: In Situ Measurements of Thermal and Electrical Effects of Strain in Flip-Chip Silicon Dies Using Synchrotron Radiation X-rays
Albert T. Wu, Chun-Yang Tsai, Chin-Li Kao, Meng-Kai Shih, Yi-Shao Lai, Hsin-Yi Lee, Ching-Shun Ku