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Journal of Electronic Materials

Ausgabe 3/2024

Includes Special Section: Electronic Packaging and Interconnections 2023. Guest Editors: Kazuhiro Nogita, Tae Kyu Lee, and Christopher Gourlay

Inhalt (45 Artikel)

Review Article

Optimizing Heat-Treated Al-BDC@TiO2 to Improve the Electrochemical Properties of Lithium-Sulfur Batteries

Kaiyu Xue, Liping Chen, Dingding Wu, Yang Bai, Juan Wang

Original Research Article

Incomplete Ionization-Dependent Carrier Mobility in Silicon-on-Insulator n-p-n Double-Gate Tunnel Field-Effect Transistors

Priyam Pathak, Deepjyoti Deb, Dwipayan Nath, Prachuryya Subash Das, Hirakjyoti Choudhury, Rupam Goswami

Original Research Article

Electron–Phonon Coupling and Carrier Relaxation Times in Gallium Antimonide Under Strain

Nandan Tandon, J. D. Albrecht, S. C. Badescu

Topical Collection: Electronic Packaging and Interconnections 2023

Numerical Analysis of the Thermal and Mechanical Performance of Cu Pillar Bumps During Reflow: Effects of Height and Solder Material

Jing Rou Lee, Mun Xi Chong, Mohd Sharizal Abdul Aziz, Chu Yee Khor, Mohd Arif Anuar Mohd Salleh, Mohd Remy Rozainy Mohd Arif Zainol, F. Che Ani

Topical Collection: Electronic Packaging and Interconnections 2023

The Effect of Temperature on the Electrical Resistivity of Sn-Bi Alloys

Xin F. Tan, Qichao Hao, Jiye Zhou, Stuart D. McDonald, Keith Sweatman, Kazuhiro Nogita

Open Access Topical Collection: Electronic Packaging and Interconnections 2023

Study on Phase Electromigration and Segregation Behavior of Cu-Cored Sn-58Bi Solder Interconnects under Electric Current Stressing

Shuibao Liang, Han Jiang, Jiaqiang Huang

Topical Collection: Electronic Packaging and Interconnections 2023

Impact of Cu Pillar Bump Diameter and Solder Material on Reflow Soldering: A Computational Study with Thermal Fluid–Structure Interaction

Jing Rou Lee, Mohd Sharizal Abdul Aziz, Chu Yee Khor, Mohammad Hafifi Hafiz Ishak, Roslan Kamarudin, F. Che Ani

Topical Collection: Electronic Packaging and Interconnections 2023

Damage Mechanisms in Through-Silicon Vias Due to Thermal Exposure and Electromigration

Tae-kyu Lee, Hanry Yang, Indranath Dutta

Topical Collection: Electronic Packaging and Interconnections 2023

Investigating the Effects of Rapid Precipitation of Bi in Sn on the Shear Strength of BGA Sn-Bi Alloys

Qichao Hao, Xin F. Tan, Stuart D. McDonald, Keith Sweatman, Tetsuya Akaiwa, Kazuhiro Nogita

Topical Collection: Electronic Packaging and Interconnections 2023

In Situ Electrical Characterization of Transient Liquid-Phase Sintered Alloys

G. Nave, P. McCluskey

Topical Collection: Electronic Packaging and Interconnections 2023

Network Structure and Mechanical Properties of Flexible Electronic Interconnects based on Linear Low-Density Polyethylene (LLDPE) and Liquid Silicone Rubber (LSR) Conductive Polymer Composites

Khairul Anwar Abdul Halim, M. A. A. Mohd Salleh, Farah Badrul, Azlin Fazlina Osman, Mohd Firdaus Omar, Anis Syazwani Suhaimi, Muhammad Salihin Zakaria

Topical Collection: Electronic Packaging and Interconnections 2023

The Interfacial Reaction of Ni/In/Ni Sandwich Structure During Solid-State Isothermal Aging

Yu-Chieh Wang, Fan-Yi Ouyang

Topical Collection: Electronic Packaging and Interconnections 2023

Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys

Hannah N. Fowler, Sukshitha Achar Puttur Lakshminarayana, Sean Yenyu Lai, Sui Xiong Tay, Aleena Masaeng, Ganesh Subbarayan, John E. Blendell, Carol A. Handwerker

Topical Collection: Electronic Packaging and Interconnections 2023

Changes in the Microstructure and Electrical Resistance of SnBi-Based Solder Joints during Current Stressing

Javier Flores, Sitaram Panta, Faramarz Hadian, Eric Cotts

Original Research Article

Pressure Sintering of Micro-Silver Joints in SiC Power Devices: Optimization of Processing Parameters and FEM Analysis

Guang Yang, Ee Lynn Lee, Kai Yang, Fengshun Wu, Longzao Zhou, Liguo Ding, Kewei Li, Xuemin Li

Original Research Article

Rice Husk Ash: Effective Reinforcement for Epoxy-Based Composites for Electronic Applications

V. S. Darekar, M. G. Kulthe, A. Goyal, R. K. Goyal

Original Research Article

Prefabrication and Characterization of Copper–Silver Foam Composites for Low-Temperature Interconnection of Power Modules

Yinxiang Fan, Haidong Yan, Junye Li, Guoping Lv, Yuncan Liu, Yakun Zhang, Chaohui Liu

Open Access Original Research Article

Microstructural Response of Highly Porous Sintered Nano-silver Particle Die Attachments to Thermomechanical Cycling

Pearl A. Agyakwa, Stuart Robertson, Jingru Dai, Bassem Mouawad, Zhaoxia Zhou, Changqing Liu, C. Mark Johnson

Original Research Article

Stereological Analysis of Microstructural Evolution Due to Aging in SnAgCu Solder Alloys

S. Chavali, S. S. Ganti, H. Liao, G. Subbarayan, I. Dutta, M. Dayananda

Original Research Article

A Cu Pillar Bump Bonding Method Using Au-Sn Alloy Cap as the Interconnection Layer

Yuhua Hu, Yan Zhang, Zuguo Bao, Jing Wu, Jie Li, Jie Wu, Min Huang

Original Research Article

Electrical Performance of a Dual-Band Composite Radome

Ruizhe Chen, Tian Tan, Zelin Liu, Yonggang Xu, Xinyu Hou

Original Research Article

An Improved Z-Shaped Dual-Material-Gate DM-SDZ-TFET Biosensor for Label-Free Detection

Jayalakshmi Bitra, Gurumurthy Komanapalli

Original Research Article

The Sensitizing Effect of Enhanced NO2 Gas Sensing at Near-Room Temperature Using Pd-Decorated VO2 Nanowires

Shuai Liu, Jiale Xue, Yinggang Liu, Yan Cui, Jie Qiu, Ruojun Xu, Guoxiang Chen

Original Research Article

Activated Green Resources from Black Tiger Shrimp Shells to Produce O-N-P Self-Co-Doped Carbon Nanofiber for High-Performance Supercapacitor

Rakhmawati Farma, Indira Valensia, Irma Apriyani, Mohamad Deraman, Awitdrus, Erman Taer

Open Access Original Research Article

Carbon Nitride Supported Ultra-fine Bismuth Sulfide Based Supercapacitor for Low Frequency Oscillator Application

Pooja Kumari, Venkata K. Perla, Sarit K. Ghosh, Chandan Saha, Parameshwar Kommu, Kaushik Mallick

Original Research Article

Machine Learning Algorithms in Photovoltaics: Evaluating Accuracy and Computational Cost Across Datasets of Different Generations, Sizes, and Complexities

Omar Al-Saban, Muath Alkadi, Saif M. H. Qaid, Abdullah Ahmed Ali Ahmed, Sameh O. Abdellatif

Original Research Article

Optimization of Non-fullerene Organic Photovoltaics Through Interface Engineering with Graphene Oxide: A Numerical Simulation

Najmudin Fauji, Kardiman, Vita Efelina, Muhammad Fahmi Hakim, Farradina Choria Suci, Rizal Hanifi, Iwan Nugraha Gusniar, Eri Widianto

Original Research Article

Optimization of Deposition Conditions of SrZrS3 Perovskite Thin Films Grown by Chemical Bath Deposition

Areej Fatima, Shahid Iqbal, Tanzeela Fazal, Bushra Ismail, Mazloom Shah, Ambreen Ayub, Qaiser Mahmood, Nasser S. Awwad, Hala A. Ibrahium, Foziah F. Al-Fawzan, Eslam B. Elkaeed

Original Research Article

Topological Insulator TlBiSe2/GaN Vertical Heterojunction Diode for High Responsive Broadband UV to Near-Infrared Photodetector

Gyanendra Kumar Maurya, Vidushi Gautam, Faizan Ahmad, Roshani Singh, Sandeep Verma, Kavindra Kandpal, Rachana Kumar, Mahesh Kumar, Akhilesh Tiwari, Pramod Kumar

Original Research Article

Performance Improvement of Photodetectors Based on ZIF-8 Nanostructures on Porous Silicon Substrate

Shadi Ghafari, Mahmood Kazemzad, Nima Naderi, Mohamad Javad Eshraghi

Original Research Article

Investigation of Quaternary BF-0.32PT-0.05BZ-xPNN Piezoelectric Ceramics with High Transduction Coefficient

Jiacheng Du, Fanhao Jia, Yongchen Wang, Congcong Tian, Jianguo Chen, Wei Ren, Hui Zhao, Yan Wang, Jinrong Cheng

Original Research Article

Study of Entropy Production of Magnetoelectric Multiferroic Materials

María Sol Ruiz, Adrián Razzitte

Original Research Article

Theoretical Studies on Structural, Electronic, Piezoelectric, and Optical Properties of Janus Sc2CXY (X ≠ Y, X/Y = F, Cl, Br, and I) MXenes

Yanzong Wang, Nan Hu, Qinfang Zhang, Yihan Ma, Rui Huang, Benling Gao, Zhongwen Li

Original Research Article

Metamaterial Wave Absorber for Harvesting Electromagnetic Energy with Dispersion Characteristics Using Palm Oil Frond Graphitic Carbon

Mohammad Ullah, Mst Ishrat Jahan, Izan Izwan Misnon, Hamzah Ahmad, Karnan Manickavasakam, Rajan Jose

Original Research Article

X-Ray Diffraction Studies of l-Isoleucine Under Shocked Conditions

S. Sahaya Jude Dhas, A. Sivakumar, Lidong Dai, Raju Suresh Kumar, Abdulrahman I. Almansour, S. A. Martin Britto Dhas

Original Research Article

Single-Layer Terahertz Tri-band Bandpass Filter Employing High-Temperature Superconducting Metamaterial

Xianshun Cai, Zhongyin Xiao, Yulong Liu, Xinwen Wang, Pei Cheng

Original Research Article

Design and Analysis of Self-Hexplexing Antenna Using SIW Hexagonal Cavity

Harsh Kumar, Garima Srivastava, Sachin Kumar

Original Research Article

Design and Substrate Material-Based Analysis of a Sriyantra/Srichakra-Shaped Fractal Wideband Monopole Antenna for S-, C-, X-, and Ku-band Communication Applications

Srinivasa Rao Ghali, B. T. P. Madhav, Moath Alathbah, P. Pardhasaradhi, Nagandla Prasad

Original Research Article

Study of Cu-Zn Spinel Ferrites on Europium Substitution for High-Frequency Applications

Ashfaq Ahmad, Hassan M. Khan, Mohammad Imran, Mohammad A. Assiri, Imran Sadiq, Naveed Ahmad, Muhammad Iqbal Hajana, J. El Ghoul, Sharif Abu Alrub, Zainab Mufarreh Elqahtani

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