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Journal of Electronic Materials

Erschienen in:

12.01.2024 | Topical Collection: Electronic Packaging and Interconnections 2023

Changes in the Microstructure and Electrical Resistance of SnBi-Based Solder Joints during Current Stressing

verfasst von: Javier Flores, Sitaram Panta, Faramarz Hadian, Eric Cotts

Erschienen in: Journal of Electronic Materials | Ausgabe 3/2024

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Abstract

The change in the electrical resistance of a SnBi-based solder joint during current stressing has been measured. For early times, a distinct, non-linear signal was observed and correlated with the initial formation of a continuous Bi layer via a lateral growth mechanism. For later times, a linear increase in the electrical resistance of the solder joints with respect to time was observed. The change in electrical resistance was found to be linearly proportional to the thickness of a continuous Bi layer accumulating at the anode during current stressing. Thus, a linear relationship between the change in electrical resistance and the thickness of the Bi layer was observed; the proportionality coefficient was found to be very large, consistent with a Bi morphology with micron-sized grains. Measurements of the mean times to failure for particular values of current density and temperature were characterized using Black’s equation. This formalism provides acceleration factors for laboratory current stressing of such low-temperature solder joints.

Vorheriger Artikel Effect of Sb and Ag Addition and Aging on the Microstructural Evolution, IMC Layer Growth, and Mechanical Properties of Near-Eutectic Sn-Bi Alloys

Nächster Artikel Pressure Sintering of Micro-Silver Joints in SiC Power Devices: Optimization of Processing Parameters and FEM Analysis

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Titel: Changes in the Microstructure and Electrical Resistance of SnBi-Based Solder Joints during Current Stressing
verfasst von: Javier Flores
Sitaram Panta
Faramarz Hadian
Eric Cotts
Publikationsdatum: 12.01.2024
Verlag: Springer US
Erschienen in: Journal of Electronic Materials / Ausgabe 3/2024
Print ISSN: 0361-5235
Elektronische ISSN: 1543-186X
DOI: https://doi.org/10.1007/s11664-023-10875-z

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