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Journal of Materials Science
Erschienen in: Journal of Materials Science 32/2022

09.08.2022 | Metals & corrosion

Effects of GNSs addition on the electromigration of Sn58Bi and Cu-core Sn58Bi joint

verfasst von: Peng Liu, Weiqi Guo, Ping Wu

Erschienen in: Journal of Materials Science | Ausgabe 32/2022

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Abstract

Graphene nanosheets (GNSs) modified Sn58Bi and Cu-core Sn58Bi solder joints were manufactured in this work. The evolution of microstructure and growth of intermetallic compounds (IMCs) under current stressing were carefully investigated. The results show that the addition of GNSs aggravates the electromigration behavior in Sn58Bi solder joints, while it inhibits the mass transfer in Cu-core Sn58Bi solder joints. The effects of GNSs on the Bi migration were well discussed with the assistance of the finite element simulation. Furthermore, the local current density was calculated, considering the influence of microstructure, to analyze the formation of IMC particles existing in the solder matrix.
Vorheriger Artikel Effects of destabilization and tempering on microstructure and mechanical properties of a hypereutectic high-chromium cast iron
Nächster Artikel Application of cross-rolling and austempering–tempering to the production of rotary cutting tools

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Literatur
1.
Black JR (1969) Electromigration—a brief survey and some recent results. IEEE Trans Electron Devices 16(4):338–347CrossRef
2.
Tseng IH, Li YJ, Lin B et al. (2019) High electromigration lifetimes of nano twinned Cu redistribution lines. In: 2019 IEEE 69th electronic components and technology conference (ECTC). IEEE, pp 1328–1332
3.
Sun Z, Yu S, Zhou H et al (2020) Emspice: physics-based electromigration check using coupled electronic and stress simulation. IEEE Trans Device Mater Reliab 20(2):376–389CrossRef
4.
Frank T, Chappaz C, Leduc P et al (2011) Resistance increase due to electromigration induced depletion under TSV. In: 2011 international reliability physics symposium. IEEE, pp 3F4.1–3F.4.6
5.
Davis EM, Harding WE, Schwartz RS et al (1964) Solid logic technology: versatile, high-performance microelectronics. IBM J Res Dev 8(2):102–114CrossRef
6.
Tu KN, Zeng K (2001) Tin-lead (SnPb) solder reaction in flip chip technology. Mater Sci Eng R Rep 34(1):1–58CrossRef
7.
Abtew M, Selvaduray G (2000) Lead-free solders in microelectronics. Mater Sci Eng R Rep 27(5–6):95–141CrossRef
8.
Zhu W, Zhang W, Zhou W et al (2019) Improved microstructure and mechanical properties for SnBi solder alloy by addition of Cr powders. J Alloys Compd 789:805–813CrossRef
9.
El-Daly AA, Ibrahiem AA (2018) Assessment of room-temperature short-term stress relaxation and strain relaxation with recovery in Sn–Bi lead-free solders solidified under rotating magnetic field. J Alloys Compd 730:47–56CrossRef
10.
Wang F, Chen H, Huang Y et al (2019) Recent progress on the development of Sn–Bi based low-temperature Pb-free solders. J Mater Sci Mater Electron 30(4):3222–3243CrossRef
11.
Chan YC, Yang D (2010) Failure mechanisms of solder interconnects under current stressing in advanced electronic packages. Prog Mater Sci 55(5):428–475CrossRef
12.
Zhang XF, Liu HY, Guo JD et al (2011) Inhibition of electromigration in eutectic SnBi solder interconnect by plastic prestraining. J Mater Sci Technol 27(11):1072–1076CrossRef
13.
Chen C, Huang C (2008) Effects of silver doping on electromigration of eutectic SnBi solder. J Alloys Compd 461(1–2):235–241CrossRef
14.
Xu G, Guo F, Wang X et al (2011) Retarding the electromigration effects to the eutectic SnBi solder joints by micro-sized Ni-particles reinforcement approach. J Alloys Compd 509(3):878–884CrossRef
15.
Liu XD, Han YD, Jing HY et al (2013) Effect of graphene nanosheets reinforcement on the performance of Sn–Ag–Cu lead-free solder. Mater Sci Eng A 562:25–32CrossRef
16.
Xu LY, Wang L, Jing HY et al (2015) Effects of graphene nanosheets on interfacial reaction of Sn–Ag–Cu solder joints. J Alloys Compd 650:475–481CrossRef
17.
Xu LY, Zhang ZK, Jing HY et al (2015) Effect of graphene nanosheets on the corrosion behavior of Sn–Ag–Cu solders. J Mater Sci Mater Electron 26(8):5625–5634CrossRef
18.
Hu X, Chan YC, Zhang K et al (2013) Effect of graphene doping on microstructural and mechanical properties of Sn–8Zn–3Bi solder joints together with electromigration analysis. J Alloys Compd 580:162–171CrossRef
19.
Ma Y, Li X, Zhou W et al (2017) Reinforcement of graphene nanosheets on the microstructure and properties of Sn58Bi lead-free solder. Mater Des 113:264–272CrossRef
20.
Ma Y, Li X, Yang L et al (2017) Effects of graphene nanosheets addition on microstructure and mechanical properties of SnBi solder alloys during solid-state aging. Mater Sci Eng A 696:437–444CrossRef
21.
Chou TT, Song RW, Chen H et al (2019) Low thermal budget bonding for 3D-package by collapse-free hybrid solder. Mater Chem Phys 238:121887CrossRef
22.
23.
Siewert T, Liu S, Smith DR et al (2002) Properties of lead-free solders, vol 4. Release
24.
Yang QL, Shang JK (2005) Interfacial segregation of Bi during current stressing of Sn–Bi/Cu solder interconnect. J Electron Mater 34(11):1363–1367CrossRef
25.
Chen CM, Huang CC, Liao CN et al (2007) Effects of copper doping on microstructural evolution in eutectic SnBi solder stripes under annealing and current stressing. J Electron Mater 36(7):760–765CrossRef
26.
Mu W, Zhou W, Li B et al (2014) Janus-faced Cu-core periphery formation and Bi phase redistribution under current stressing in Cu-cored Sn58Bi solder joints. J Alloys Compd 584:483–486CrossRef
27.
Madanipour H, Kim YR, Kim CU et al (2021) Study of electromigration in Sn–Ag–Cu micro solder joint with Ni interfacial layer. J Alloys Compd 862:158043CrossRef
28.
Zhao X, Muraoka M, Saka M (2017) Length-dependent electromigration behavior of Sn58Bi solder and critical length of electromigration. J Electron Mater 46(2):1287–1292CrossRef
29.
Wang F, Liu L, Li D et al (2018) Electromigration behaviors in Sn-58Bi solder joints under different current densities and temperatures. J Mater Sci Mater Electron 29(24):21157–21169CrossRef
30.
Chen CM, Chen LT, Lin YS (2007) Electromigration-induced Bi segregation in eutectic SnBi solder joint. J Electron Mater 36(2):168–172CrossRef
31.
Dyson BF, Anthony TR, Turnbull D (1967) Interstitial diffusion of copper in tin. J Appl Phys 38(8):3408–3408CrossRef
32.
Huang ML, Zhao JF, Zhang ZJ et al (2015) Role of diffusion anisotropy in β-Sn in microstructural evolution of Sn–3.0Ag–0.5Cu flip chip bumps undergoing electromigration. Acta Mater 100:98–106CrossRef
33.
Lee K, Kim KS, Tsukada Y et al (2011) Influence of crystallographic orientation of Sn–Ag–Cu on electromigration in flip-chip joint. Microelectron Reliab 51(12):2290–2297CrossRef
34.
Tian Y, Han J, Ma L et al (2018) The dominant effect of c-axis orientation in tin on the electromigration behaviors in tricrystal Sn–3.0Ag–0.5Cu solder joints. Microelectron Reliab 80:7–13CrossRef
35.
Ma H, La Mattina F, Shorubalko I et al (2017) Engineering the grain boundary network of thin films via ion-irradiation: towards improved electromigration resistance. Acta Mater 123:272–284CrossRef
36.
Chen JQ, Guo JD, Liu KL et al (2013) Dependence of electromigration damage on Sn grain orientation in Sn–Ag–Cu solder joints. J Appl Phys 114(15):153509CrossRef
37.
Lu M, Shih DY, Lauro P et al (2008) Effect of Sn grain orientation on electromigration degradation mechanism in high Sn-based Pb-free solders. Appl Phys Lett 92(21):211909CrossRef
38.
Qin H, Liu T, Li W et al (2020) Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing. Microelectron Reliab 115:113995CrossRef
39.
Kelly MB, Niverty S, Chawla N (2020) Four dimensional (4D) microstructural evolution of Cu6Sn5 intermetallic and voids under electromigration in bi-crystal pure Sn solder joints. Acta Mater 189:118–128CrossRef
Metadaten
Titel
Effects of GNSs addition on the electromigration of Sn58Bi and Cu-core Sn58Bi joint
verfasst von
Peng Liu
Weiqi Guo
Ping Wu
Publikationsdatum
09.08.2022
Verlag
Springer US
Erschienen in
Journal of Materials Science / Ausgabe 32/2022
Print ISSN: 0022-2461
Elektronische ISSN: 1573-4803
DOI
https://doi.org/10.1007/s10853-022-07590-1

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