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Journal of Materials Science: Materials in Electronics

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09-04-2021

High dielectric CsPbBr₃/rGO/polyimide composite prepared via in-situ conversion of fillers

Authors: Zewei Zhu, Yingbo Liu, Mengle Kong, Junqi Ge, Zhaoyu Hu, Xuehui Peng, Wenhui Xu, Yichun Ding, Haoqing Hou, Xinwen Peng

Published in: Journal of Materials Science: Materials in Electronics | Issue 9/2021

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Abstract

High dielectric (high-k) polymer matrix composites (PMCs) have attracted much attention owing to their moderate dielectric property, good thermal stability, and excellent mechanical flexibility, as well as facile processability, light weight, and low cost. Herein, we report an in-situ synthesis strategy to fabricate high-performance high-k PMCs. A novel perovskite CsPbBr₃/rGO/polyimide composite is fabricated by in-situ polymerization of poly(amic acid) (PAA) followed by thermal imidization, in-situ chemical reduction of graphene oxide (GO), and in-situ crystallization of CsPbBr₃ nanoparticles. The fillers are uniformly dispersed in the polyimide (PI) matrix due to the multiple in-situ conversion processes, which form numerous micro-capacitors to enhance the dielectric permittivity. Attributing to the synergetic effect between rGO and CsPbBr₃ nanocrystals, the CsPbBr₃/rGO/PI composite showed a high dielectric permittivity up to 213, a high energy storage density of up to 5.20 J cm⁻³, and a dielectric loss less than 0.35. Besides, the thermal stability of the composites is enhanced (5% weight loss temperature (T_5%) > 523 °C), and the mechanical strength is well retained under a relatively low filling amount of fillers (10 wt% CsPbBr₃). Therefore, the as-fabricated CsPbBr₃/rGO/PI composites would be promising for applications in energy storage polymer thin-film capacitors, and this research also opens a new avenue to fabricate high-k PMCs with good comprehensive properties.

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Title: High dielectric CsPbBr3/rGO/polyimide composite prepared via in-situ conversion of fillers
Authors: Zewei Zhu
Yingbo Liu
Mengle Kong
Junqi Ge
Zhaoyu Hu
Xuehui Peng
Wenhui Xu
Yichun Ding
Haoqing Hou
Xinwen Peng
Publication date: 09-04-2021
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 9/2021
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-021-05872-z

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