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Deformation and Fatigue of Solders Read chapter Read first chapter

2011 | OriginalPaper | Chapter

10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration

Author : P.-E. Tegehall

Published in: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Publisher: Springer London

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Abstract

Many electronics products are used in humid environments. High humidity in combination with various contaminants will affect the surface insulation resistance on printed board assemblies and may cause current leakage or in worse case short circuit due to electrochemical migration. This chapter discusses the failure mechanism for electrochemical migration and how it is affected by common contaminants on assemblies. Test methods for measuring surface insulation resistance and for assessing the risk for electrochemical migration are reviewed, and their relevance is discussed.

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previous chapter Reliability of Electronic Assemblies Under Mechanical Shock Loading
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Metadata
Title
Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration
Author
P.-E. Tegehall
Copyright Year
2011
Publisher
Springer London
Book
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Print ISBN: 978-0-85729-235-3

Electronic ISBN: 978-0-85729-236-0

Copyright Year: 2011

DOI
https://doi.org/10.1007/978-0-85729-236-0_10