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Erschienen in:
Deformation and Fatigue of Solders Kapitel lesen Erstes Kapitel lesen

2011 | OriginalPaper | Buchkapitel

10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration

verfasst von : P.-E. Tegehall

Erschienen in: The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Verlag: Springer London

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Abstract

Many electronics products are used in humid environments. High humidity in combination with various contaminants will affect the surface insulation resistance on printed board assemblies and may cause current leakage or in worse case short circuit due to electrochemical migration. This chapter discusses the failure mechanism for electrochemical migration and how it is affected by common contaminants on assemblies. Test methods for measuring surface insulation resistance and for assessing the risk for electrochemical migration are reviewed, and their relevance is discussed.

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Vorheriges Kapitel Reliability of Electronic Assemblies Under Mechanical Shock Loading
Nächstes Kapitel Lead-Free and Other Process Effects on Conductive Anodic Filamentation Resistance of Glass-Reinforced Epoxy Laminates
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Metadaten
Titel
Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration
verfasst von
P.-E. Tegehall
Copyright-Jahr
2011
Verlag
Springer London
Buch
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects

Print ISBN: 978-0-85729-235-3

Electronic ISBN: 978-0-85729-236-0

Copyright-Jahr: 2011

DOI
https://doi.org/10.1007/978-0-85729-236-0_10