Top

Journal of Materials Engineering and Performance

Published in:

23-06-2020

Influence of Reflow Profile on Thermal Fatigue Behaviors of Solder Ball Joints

Authors: Eunice Y. Seo, Jong E. Ryu

Published in: Journal of Materials Engineering and Performance | Issue 6/2020

Activate our intelligent search to find suitable subject content or patents.

search-config

AI-assisted search

Off

Abstract

In electronic package design, solder joints are critical in providing electrical connections and mechanical support. The mechanical reliability of interconnection is dependent on the microstructure evolution that occurs within the solder due to the temperature changes primarily from transportation, storage, and device usage. In this study, two solder alloys, eutectic 63Sn37Pb and lead-free 95.5Sn4.0Ag0.5Cu, were tested for their thermal fatigue reliability and were observed for changes in microstructure. The different microstructures of each sample were created by controlling the cooling rate, fast or slow, during reflow. To characterize reliability, the samples endured thermal cycling − 40-125 °C until electrical failure. Finite element analysis was used to predict the primary deformation mechanism. The microstructure was inspected by cross-sectioning the solder samples using scanning electron microscopy with energy-dispersive x-ray spectroscopy. It was found that by controlling the microstructure development through the reflow rate, the solder joint’s thermal fatigue life can be extended, and concurrently, the reliability of the electronic package can be enhanced.

previous article Joining Aluminum Alloy to Steel by Resistance Projection-Plug Welding

next article Investigation of Microstructure, Mechanical Properties, and Numerical Modeling of Ti6Al4V Joints Produced by Friction Stir Spot Welding

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

über 102.000 Bücher
über 537 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Finance + Banking
Management + Führung
Marketing + Vertrieb
Maschinenbau + Werkstoffe
Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

über 67.000 Bücher
über 390 Zeitschriften

aus folgenden Fachgebieten:

Automobil + Motoren
Bauwesen + Immobilien
Business IT + Informatik
Elektrotechnik + Elektronik
Energie + Nachhaltigkeit
Maschinenbau + Werkstoffe

Jetzt Wissensvorsprung sichern!

inform now

S. Zhang, X. Xu, T. Lin, and P. He, Recent Advances in Nano-Materials for Packaging of Electronic Devices, J. Mater. Sci. Mater. Electron., 2019, 30(15), p 13855–13868CrossRef

S. Zhang and K.-W. Paik, A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling, IEEE Trans. Compon. Packag. Manuf. Technol., 2016, 6(2), p 216–223CrossRef

A. Longford, Chip Packaging Challenges… A Roadmap Based Overview, Microelectron. Int., 2005, 22(2), p 17–20CrossRef

I. Kim and S.B. Lee, Fatigue Life Evaluation of Lead-Free Solder Under Thermal and Mechanical Loads, in Proceedings—Electronic Components and Technology Conference, (Reno, NV) (2007), pp. 95–104

M. McCormack and S. Jin, New, Lead-Free Solders, J. Electron. Mater., 1994, 23(7), p 635–640CrossRef

K. Suganuma, Advances in Lead-Free Electronics Soldering, Curr. Opin. Solid State Mater. Sci., 2001, 5(1), p 55–64CrossRef

D. Shangguan, Lead-Free Solder Interconnect Reliability, ASM International, Cleveland, 2005

S. Zhang, B. Zhu, X. Zhou, X. Wang, T. Lin, P. He, and K.W. Paik, Wettability and Interfacial Morphology of Sn-3.0Ag-0.5Cu Solder on Electroless Nickel Plated ZnS Transparent Ceramic, J. Mater. Sci. Mater. Electron., 2019, 30(19), p 17972–17985CrossRef

S. Li, X. Wang, Z. Liu, Y. Jiu, S. Zhang, J. Geng, X. Chen, S. Wu, P. He, and W. Long, Corrosion Behavior of Sn-Based Lead-Free Solder Alloys: A Review, J. Mater. Sci. Mater. Electron., 2020, 31, p 1–15

10.

M. Li, K.Y. Lee, D.R. Olsen, W.T. Chen, B.T.C. Tan, and S. Mhaisalkar, Microstructure, Joint Strength and Failure Mechanisms of SnPb and Pb-Free Solders in BGA Packages, IEEE Trans. Electron. Packag. Manuf., 2002, 25(3), p 185–192CrossRef

11.

D.R. Frear, Microstructural Evolution During Thermomechanical Fatigue of 62Sn-36Pb-2Ag and 60Sn-40Pb Solder Joints, IEEE Trans. Compon. Hybrids Manuf. Technol., 1990, 13(4), p 718–726CrossRef

12.

J.H.L. Pang, T.H. Low, B.S. Xiong, X. Luhua, and C.C. Neo, Thermal Cycling Aging Effects on Sn-Ag-Cu Solder Joint Microstructure, IMC and Strength, Thin Solid Films, 2004, 462-463(SPEC. ISS.), p 370–375CrossRef

13.

H.L.J. Pang, K.H. Tan, X.Q. Shi, and Z.P. Wang, Microstructure and Intermetallic Growth Effects on Shear and Fatigue Strength of Solder Joints Subjected to Thermal Cycling Aging, Mater. Sci. Eng. A, 2001, 307(1-2), p 42–50CrossRef

14.

J.H.L. Pang, K.H. Tan, X. Shi, and Z.P. Wang, Thermal Cycling Aging Effects on Microstructural and Mechanical Properties of a Single PBGA Solder Joint Specimen, IEEE Trans. Compon. Packag. Technol., 2001, 24(1), p 10–15CrossRef

15.

S. Nurmi, J. Sundelin, E. Ristolainen, and T. Lepistö, The Effect of Solder Paste Composition on the Reliability of SnAgCu Joints, Microelectron. Reliab., 2004, 44(3), p 485–494CrossRef

16.

C.K. Lin and D.Y. Chu, Creep Rupture of Lead-Free Sn-3.5Ag and Sn-3.5Ag-0.5Cu Solders, J. Mater. Sci. Mater. Electron., 2005, 16(6), p 355–365CrossRef

17.

S. Wiese and K.J. Wolter, Microstructure and Creep Behaviour of Eutectic SnAg and SnAgCu Solders, Microelectron. Reliab., 2004, 44(12), p 1923–1931CrossRef

18.

V.I. Igoshev, J.I. Kleiman, D. Shangguan, S. Wong, and U. Michon, Fracture of Sn-3.5%Ag Solder Alloy under Creep, J. Electron. Mater., 2000, 29(12), p 1356–1361CrossRef

19.

D.K. Joo, J. Yu, and S.W. Shin, Creep Rupture of Lead-Free Sn-3.5Ag-Cu Solders, J. Electron. Mater., 2003, 32(6), p 541–547CrossRef

20.

J.J. Sundelin, S.T. Nurmi, T.K. Lepistö, and E.O. Ristolainen, Microstructure, Creep Properties, and Failure Mechanism of SnAgCu Solder Joints, J. Electron. Mater., 2006, 35(7), p 1600–1606CrossRef

21.

C. Kanchanomai, Y. Miyashita, and Y. Mutoh, Low Cycle Fatigue Behavior and Mechanisms of a Eutectic Sn-Pb Solder 63Sn/37Pb, Int. J. Fatigue, 2002, 24(6), p 671–683CrossRef

22.

S.H. Fan, Y.C. Chan, C.W. Tang, and J.K.L. Lai, Aging Studies of PBGA Solder Joints Reflowed at Different Conveyor Speeds, IEEE Trans. Adv. Packag., 2001, 24(4), p 486–492CrossRef

23.

J.H. Constable, W. Butler, C. Huang, and J.M. Pitarresi, CSP Fatigue Life Predictions Based on Electrical Resistance Change, Adv. Electron. Packag., 2001, 1, p 1–7

24.

Temperature Cycling 22-A104-B, JEDEC Standard, JEDEC Solid State Technology Association (2005)

25.

M. Yunus, K. Srihari, J.M. Pitarresi, and A. Primavera, Effect of Voids on the Reliability of BGA/CSP Solder Joints, Microelectron. Reliab., 2003, 43(12), p 2077–2086CrossRef

26.

B.Z. Hong, Thermal Fatigue Analysis of a CBGA Package with Lead-Free Solder Fillets in Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference, (Seattle, WA) (IEEE, 1998), pp. 205–211

27.

B.Z. Hong, Finite Element Modeling of Thermal Fatigue and Damage of Solder Joints in a Ceramic Ball Grid Array Package, J. Electron. Mater., 1997, 26(7), p 814–820CrossRef

28.

J. Lau, W. Dauksher, and P. Vianco,“Acceleration Models, Constitutive Equations, and Reliability of Lead-Free Solders and Joints, in 53rd Electronic Components and Technology Conference, (New Orleans, Louisiana) (2003), pp. 229–236

29.

Y. Zhang, H. Zhu, M. Fujiwara, J. Xu, and M. Dao, Low-Temperature Creep of SnPb and SnAgCu Solder Alloys and Reliability Prediction in Electronic Packaging Modules, Scr. Mater., 2013, 68(8), p 607–610CrossRef

30.

B. Wong, D.E. Helling, and R.W. Clark, A Creep-Rupture Model for Two-Phase Eutectic Solders, IEEE Trans. Compon. Hybrids Manuf. Technol., 1988, 11(3), p 284–290CrossRef

31.

P. Sharma and A. Dasgupta, Micro-Mechanics of Creep-Fatigue Damage in PB-SN Solder Due to Thermal Cycling—Part I: Formulation, J. Electron. Packag. Trans. ASME, 2002, 124(3), p 292–297CrossRef

32.

M.N. Islam, Y.C. Chan, M.J. Rizvi, and W. Jillek, Investigations of Interfacial Reactions of Sn-Zn Based and Sn-Ag-Cu Lead-Free Solder Alloys as Replacement for Sn-Pb Solder, J. Alloys Compd., 2005, 400(1-2), p 136–144CrossRef

33.

J.W. Yoon, B.I. Noh, B.K. Kim, C.C. Shur, and S.B. Jung, Wettability and Interfacial Reactions of Sn-Ag-Cu/Cu and Sn-Ag-Ni/Cu Solder Joints, J. Alloys Compd., 2009, 486(1-2), p 142–147CrossRef

34.

P. Sun, C. Andersson, X. Wei, Z. Cheng, D. Shangguan, and J. Liu, Intermetallic Compound Formation in Sn-Co-Cu, Sn-Ag-Cu and Eutectic Sn-Cu Solder Joints on Electroless Ni(P) Immersion Au Surface Finish after Reflow Soldering, in 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP’06, (Shanghai) (2006), pp. 287–291

35.

K.J. Puttlitz and K.A. Stalter, Handbook of Lead-Free Solder Technology for Microelectronic Assemblies, CRC Press, Boca Raton, 2004CrossRef

36.

S. Zhang, M. Yang, Y. Wu, J. Du, T. Lin, P. He, M. Huang, and K.W. Paik, A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board Application at a 250 °C Bonding Temperature, IEEE Trans. Compon. Packag. Manuf. Technol., 2018, 8(3), p 383–391CrossRef

37.

S. Zhang, T. Lin, P. He, and K.W. Paik, Effects of Acrylic Adhesives Property and Optimized Bonding Parameters on Sn-58Bi Solder Joint Morphology for Flex-on-Board Assembly, Microelectron. Reliab., 2017, 78, p 181–189CrossRef

Title: Influence of Reflow Profile on Thermal Fatigue Behaviors of Solder Ball Joints
Authors: Eunice Y. Seo
Jong E. Ryu
Publication date: 23-06-2020
Publisher: Springer US
Published in: Journal of Materials Engineering and Performance / Issue 6/2020
Print ISSN: 1059-9495
Electronic ISSN: 1544-1024
DOI: https://doi.org/10.1007/s11665-020-04899-3

Springer Professional

Abstract

Please log in to get access to your license.

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Springer Professional "Technik"

Other articles of this Issue 6/2020

Factors Influencing the Corrosion Behavior of Direct Metal Laser Sintered Ti-6Al-4V for Biomedical Applications

Carburizing Heat Treatment of Selective-Laser-Melted 20MnCr5 Steel

Effect of Stress State in Rolling Deformation Zone of AZ31 Magnesium Alloy Plate on Edge Cracking

Boro-Austempering Treatment of High-Strength Bainitic Steels

Analysis of the Impact of the Consolidated Material on the Morphology of Briquettes Produced in a Roller Press

Spheroidization Mechanism of Lamellar δ Phase in Inconel 718 during Delta Processing

Premium Partners