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Journal of Materials Science: Materials in Electronics
Published in: Journal of Materials Science: Materials in Electronics 3/2015

01-03-2015

Interface-related resistive switching in BiFeO3 thin films

Authors: L. Jin, Y. Shuai, H. Z. Zeng, W. B. Luo, C. G. Wu, W. L. Zhang, X. Q. Pan, P. Zhang, Y. R. Li

Published in: Journal of Materials Science: Materials in Electronics | Issue 3/2015

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Abstract

Polycrystalline BiFeO3 thin films have been grown by pulsed laser deposition on Pt/Ti/SiO2/Si substrates. The microstructures of the thin films were characterized by X-ray-diffraction and scanning electronic microscopy. The resistive switching in BiFeO3 thin films has been systematically investigated by current–voltage measurements. It has been observed that the oxygen ambient pressure during the deposition influences the ON/OFF ratio of the switching. The substrate temperature affects the rectifying behaviour of the thin films, and consequently determines the possibility of resistive switching in BiFeO3 thin films. By varying the thickness of the thin film, it has been revealed that the switching takes place near the electrode/film interface. The mechanism of the observed resistive switching has been attributed to a charge trapping effect at the interface.
previous article Saturated hysteresis loops and conduction mechanisms in Mn-doped BiFeO3 thin films derived from sol–gel process
next article Enhanced magnetic and ferroelectric properties in Cr doped Bi2Fe4O9 ceramics

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Literature
1.
2.
R. Waser, R. Dittmann, G. Staikov, K. Szot, Adv. Mater. 21(25–26), 2632 (2009)CrossRef
3.
4.
D.-H. Kwon, K.M. Kim, J.H. Jang, J.M. Jeon, M.H. Lee, G.H. Kim, X.-S. Li, G.-S. Park, B. Lee, S. Han, M. Kim, C.S. Hwang, Nat. Nanotechnol. 5(2), 148 (2010)CrossRef
5.
B.J. Choi, D.S. Jeong, S.K. Kim, C. Rohde, S. Choi, J.H. Oh, H.J. Kim, C.S. Hwang, K. Szot, R. Waser, B. Reichenberg, S. Tiedke, J. Appl. Phys. 98(3), 033715 (2005)CrossRef
6.
Y. Watanabe, J.G. Bednorz, A. Bietsch, C. Gerber, D. Widmer, A. Beck, S.J. Wind, Appl. Phys. Lett. 78(23), 3738 (2001)CrossRef
7.
A. Baikalov, Y.Q. Wang, B. Shen, B. Lorenz, S. Tsui, Y.Y. Sun, Y.Y. Xue, C.W. Chu, Appl. Phys. Lett. 83(5), 957 (2003)CrossRef
8.
D.C. Kim, S. Seo, S.E. Ahn, D.-S. Suh, M.J. Lee, B.-H. Park, I.K. Yoo, I.G. Baek, H.-J. Kim, E.K. Yim, J.E. Lee, S.O. Park, H.S. Kim, U.-I. Chung, J.T. Moon, B.I. Ryu, Appl. Phys. Lett. 88(20), 202102 (2006)CrossRef
9.
F. Miao, J.P. Strachan, J.J. Yang, M.-X. Zhang, I. Goldfarb, A.C. Torrezan, P. Eschbach, R.D. Kelley, G. Medeiros-Ribeiro, R.S. Williams, Adv. Mater. 23(47), 5633 (2011)CrossRef
10.
W.-Y. Chang, Y.-C. Lai, T.-B. Wu, S.-F. Wang, F. Chen, M.-J. Tsai, Appl. Phys. Lett. 92(2), 022110 (2008)CrossRef
11.
R. Dong, D.S. Lee, W.F. Xiang, S.J. Oh, D.J. Seong, S.H. Heo, H.J. Choi, M.J. Kwon, S.N. Seo, M.B. Pyun, M. Hasan, H. Hwang, Appl. Phys. Lett. 90(4), 042107 (2007)CrossRef
12.
13.
M.P. Singh, L. Méchin, W. Prellier, M. Maglione, Appl. Phys. Lett. 89(20), 202906 (2006)CrossRef
14.
C. Wang, K.-J. Jin, Z.-T. Xu, L. Wang, C. Ge, H.-B. Lu, H.-Z. Guo, M. He, G.-Z. Yang, Appl. Phys. Lett. 98(19), 192901 (2011)CrossRef
15.
16.
K. Yin, M. Li, Y. Liu, C. He, F. Zhuge, B. Chen, W. Lu, X. Pan, R.-W. Li, Appl. Phys. Lett. 97(4), 042101 (2010)CrossRef
17.
T. Choi, S. Lee, Y.J. Choi, V. Kiryukhin, S.-W. Cheong, Science 324(5923), 63 (2009)CrossRef
18.
Y. Shuai, S. Zhou, D. Bürger, M. Helm, H. Schmidt, J. Appl. Phys. 109(12), 124117 (2011)CrossRef
19.
Y. Shuai, S. Zhou, S. Streit, H. Reuther, D. Bürger, S. Slesazeck, T. Mikolajick, M. Helm, H. Schmidt, Appl. Phys. Lett. 98(23), 232901 (2011)CrossRef
20.
C.H. Yang, J. Seidel, S.Y. Kim, P.B. Rossen, P. Yu, M. Gajek, Y.H. Chu, L.W. Martin, M.B. Holcomb, Q. He, P. Maksymovych, N. Balke, S.V. Kalinin, A.P. Baddorf, S.R. Basu, M.L. Scullin, R. Ramesh, Nat. Mater. 8(6), 485 (2009)CrossRef
Metadata
Title
Interface-related resistive switching in BiFeO3 thin films
Authors
L. Jin
Y. Shuai
H. Z. Zeng
W. B. Luo
C. G. Wu
W. L. Zhang
X. Q. Pan
P. Zhang
Y. R. Li
Publication date
01-03-2015
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 3/2015
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2599-2

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