Skip to main content
Disciplines
Automotive Business IT + Informatics Construction + Real Estate Electrical Engineering + Electronics Energy + Sustainability Insurance + Risk Finance + Banking Management + Leadership Marketing + Sales Mechanical Engineering + Materials
Events
DE
EN
Books
Journals
Topic Page
Marketing
Start single access now
Access for companies
EXTENDED SEARCH
Log in
Top
Journal of Electronic Materials
Published in: Journal of Electronic Materials 3/2004

01-03-2004 | Regular Issue Paper

Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages

Authors: M. D. Cheng, S. Y. Chang, S. F. Yen, T. H. Chuang

Published in: Journal of Electronic Materials | Issue 3/2004

Log in

Activate our intelligent search to find suitable subject content or patents.

search-config
loading …
previous article A novel structure of woven continuous-carbon fiber composites with high electromagnetic shielding
next article The contact characteristics of SiCN films for opto-electrical devices applications

Dont have a licence yet? Then find out more about our products and how to get one now:

Springer Professional "Wirtschaft+Technik"

Online-Abonnement

Mit Springer Professional "Wirtschaft+Technik" erhalten Sie Zugriff auf:

  • über 102.000 Bücher
  • über 537 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Finance + Banking
  • Management + Führung
  • Marketing + Vertrieb
  • Maschinenbau + Werkstoffe
  • Versicherung + Risiko

Jetzt Wissensvorsprung sichern!

inform now

Springer Professional "Technik"

Online-Abonnement

Mit Springer Professional "Technik" erhalten Sie Zugriff auf:

  • über 67.000 Bücher
  • über 390 Zeitschriften

aus folgenden Fachgebieten:

  • Automobil + Motoren
  • Bauwesen + Immobilien
  • Business IT + Informatik
  • Elektrotechnik + Elektronik
  • Energie + Nachhaltigkeit
  • Maschinenbau + Werkstoffe




 

Jetzt Wissensvorsprung sichern!

inform now
Metadata
Title
Intermetallic compounds formed during the reflow and aging of Sn-3.8Ag-0.7Cu and Sn-20In-2Ag-0.5Cu solder ball grid array packages
Authors
M. D. Cheng
S. Y. Chang
S. F. Yen
T. H. Chuang
Publication date
01-03-2004
Publisher
Springer-Verlag
Published in
Journal of Electronic Materials / Issue 3/2004
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-004-0176-9

Other articles of this Issue 3/2004

Journal of Electronic Materials 3/2004 Go to the issue

Regular Issue Paper

Wafer bonding and epitaxial transfer of GaSb-based epitaxy to GaAs for monolithic interconnection of thermophotovoltaic devices

Regular Issue Paper

Comparative study of electrically conductive thick films with and without glass

Regular Issue Paper

Electrical and luminescent properties and the spectra of deep centers in GaMnN/InGaN light-emitting diodes

Regular Issue Paper

Effects of different printed-circuit-board surface finishes on the formation and growth of intermetallics at thermomechanically fatigued, small outline J leads/Sn-Ag-Cu interfaces

Regular Issue Paper

Study on Cu particles-enhanced SnPb composite solder

Regular Issue Paper

The contact characteristics of SiCN films for opto-electrical devices applications