Issue 11/2005
Content (17 Articles)
Processing and creep properties of Sn-Cu composite solders with small amounts of nanosized Ag reinforcement additions
F. Tai, F. Guo, Z. D. Xia, Y. P. Lei, Y. F. Yan, J. P. Liu, Y. W. Shi
Interfacial segregation of Bi during current stressing of Sn-Bi/Cu solder interconnect
Q. L. Yang, J. K. Shang
Cadmium sulfide passivation of InGaAs/InP mesa p-i-n photodiodes
W. A. Teynor, K. Vaccaro, W. R. Buchwald, H. M. Dauplaise, C. P. Morath, A. Davis, M. A. Roland, W. R. Clark
Creep resistance of tin-based lead-free solder alloys
M. L. Huang, C. M. L. Wu, L. Wang
Refractive indices variation with temperature and humidity of optical adhesive
A. Priyadarshi, L. Shimin, E. H. Wong, R. Rajoo, S. G. Mhaisalkar, V. Kripesh
Intermetallic reactions in a Sn-20In-2.8Ag solder ball-grid-array package with Au/Ni/Cu pads
Hui-Min Wu, Feng-Chih Wu, Tung-Han Chuang
Influence of native defects on the infrared transmission of undoped Ga1−xInxSb bulk crystals
H. J. Kim, A. Chandola, S. Guha, L. Gonzalez, V. Kumar, P. S. Dutta
Development of nano-composite lead-free electronic solders
Andre Lee, K. N. Subramanian
Characterization of sputtered nano-crystalline zirconium carbide as a diffusion barrier for Cu metallization
Cheng-Shi Chen, Chuan-Pu Liu
Density measurement of Sn-40Pb, Sn-57Bi, and Sn-9Zn by indirect Archimedean method
Lianwen Wang, Ai-Ping Xian
Formulation and characterization of anisotropic conductive adhesive paste for microelectronics packaging applications
Liqiang Cao, Shiming Li, Zonghe Lai, Johan Liu
Optical emission characteristics of ablation plasma plumes during the laser-etching process of CdTe
K. Abe, O. Eryu, S. Nakashima, M. Terai, M. Kubo, M. Niraula, K. Yasuda
Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization
Hongjin Jiang, Kyoung-Sik Moon, Jiongxin Lu, C. P. Wong
Etching of mesa structures in HgCdTe
V. Srivastav, R. Pal, B. L. Sharma, A. Naik, D. S. Rawal, V. Gopal, H. P. Vyas
Contact resistance and shear strength of the solder joints formed using Cu bumps capped with Sn or Ag/Sn layer
Seung-Hyun Lee, Hee-Ra Roh, Zhi Gang Chen, Young-Ho Kim
Effects of thermoplastic resin content of anisotropic conductive films on the pressure cooker test reliability of anisotropic conductive film flip-chip assembly
J. W. Hwang, M. J. Yim, K. W. Paik
Radiation hardness improvement of separation-by-implantation-of-oxygen/silicon-on-insulator material by nitrogen ion implantation
Enxia Zhang, Jiayin Sun, Jing Chen, Zhengxuan Zhang, Xi Wang, Ning Li, Guoqiang Zhang, Zhongli Liu