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Journal of Electronic Materials
Published in: Journal of Electronic Materials 11/2020

01-09-2020

Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin

Authors: Xuemin Sun, Weiyuan Yu, Yanhong Wang

Published in: Journal of Electronic Materials | Issue 11/2020

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Metadata
Title
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
Authors
Xuemin Sun
Weiyuan Yu
Yanhong Wang
Publication date
01-09-2020
Publisher
Springer US
Published in
Journal of Electronic Materials / Issue 11/2020
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI
https://doi.org/10.1007/s11664-020-08393-3

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