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Open Access 01-01-2011

Low-Temperature III–V Direct Wafer Bonding Surface Preparation Using a UV-Sulfur Process

Authors: Michael J. Jackson, Li-Min Chen, Ankit Kumar, Yang Yang, Mark S. Goorsky

Title: Low-Temperature III–V Direct Wafer Bonding Surface Preparation Using a UV-Sulfur Process
Authors: Michael J. Jackson
Li-Min Chen
Ankit Kumar
Yang Yang
Mark S. Goorsky
Publication date: 01-01-2011
Publisher: Springer US
Published in: Journal of Electronic Materials / Issue 1/2011
Print ISSN: 0361-5235
Electronic ISSN: 1543-186X
DOI: https://doi.org/10.1007/s11664-010-1397-8