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Journal of Materials Science: Materials in Electronics

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24-10-2020

Mechanical and microstructural enhancements of Ag microparticle-sintered joint by ultrasonic vibration

Authors: Runhua Gao, Yu-An Shen, Jiahui Li, Siliang He, Hiroshi Nishikawa

Published in: Journal of Materials Science: Materials in Electronics | Issue 23/2020

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Abstract

Silver (Ag) microparticle sintering bonding is a promising die-attach method for power device packaging. In this study, an ultrasonic-assisted bonding method that bonds chestnut-burr-like Ag microparticles rapidly at low temperatures is reported. Robust joints with an average shear strength of 36.2 MPa were achieved under ~ 240 °C (actual) 7 MPa in 300 s. Based on characterization of sintered microstructures obtained with different ultrasonic time and power, effects of the ultrasonic vibration were studied. Two unique microstructures, microbridges and dense layers, were generated with the ultrasonic vibration. The former achieved microparticle sintering, and the latter changed fracture mode of the joints from brittle interfacial debonding to ductile fracture. The results indicate the microbridges and dense layers enhanced the joints within a certain range and are generated due to crystallization driven by localized plastic deformation and localized high temperatures.

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Title: Mechanical and microstructural enhancements of Ag microparticle-sintered joint by ultrasonic vibration
Authors: Runhua Gao
Yu-An Shen
Jiahui Li
Siliang He
Hiroshi Nishikawa
Publication date: 24-10-2020
Publisher: Springer US
Published in: Journal of Materials Science: Materials in Electronics / Issue 23/2020
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI: https://doi.org/10.1007/s10854-020-04684-x

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