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Published in: Journal of Materials Science: Materials in Electronics 10/2014

01-10-2014

Mechanical properties of and critical conditions for crack initiation in electronic glass

Authors: Ya Zhou Sun, Jing Zhang, Hai Tao Liu

Published in: Journal of Materials Science: Materials in Electronics | Issue 10/2014

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Abstract

In this paper, the mechanical properties of electronic glass are tested using a combination of the Vickers indentation test and a multiple-loading nanoindentation test to obtain the elastic modulus, Poisson’s ratio and hardness values. The basic mechanical property parameters of the electronic glass and its stress–strain curve are found using atomic force microscopy analysis of the indentation morphology. The critical pressure and depth for crack initiation and the corresponding load and depth can be obtained during vertical loading on the electronic glass. When cracks extend to the surface, the results show that the electronic glass is isotropic. Several loading cycles causes a fatigue effect on the surface of the electronic glass, which decreases its elastic–plastic response. While the loadings are increasing, the elastic–plastic response rates are decreasing bur it rends stability finally. These results can provide a reference and guide for micro machining and surface microstructure machining of electronic glass.

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Metadata
Title
Mechanical properties of and critical conditions for crack initiation in electronic glass
Authors
Ya Zhou Sun
Jing Zhang
Hai Tao Liu
Publication date
01-10-2014
Publisher
Springer US
Published in
Journal of Materials Science: Materials in Electronics / Issue 10/2014
Print ISSN: 0957-4522
Electronic ISSN: 1573-482X
DOI
https://doi.org/10.1007/s10854-014-2189-3

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